Manufacturers
NEXCOM ICES 673
Description
COMe Type 6, Compact Size Module with 6th Gen. Intel® Core™ processor MCP solution, DDR4/ 5 x PCIe x 1/4 x USB3.0 / 3 x SATA3.0 and GbE
The ICES 673 is a COM Express Type 6 compact size module which features Intel® Core™ MCP processor (codename Skylake) and supports dual DDR4 SO-DIMM memory sockets with Non-ECC support, up to 32GB 2133MHz. It is integrated with Intel® integration graphics for powerful graphics processing and through interfaces like eDP and 2 x DDI. This new ICES 673 supports triple displays, on board eMMC up to 16G, and advanced I/O interfaces such as 5 x PCI Express gen. 3, 3 x SATA3.0, and 8 x USB 2.0.
Part Number
ICES 673
Price
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Manufacturer
NEXCOM
Lead Time
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Category
Embedded Computers » Computer-on-Module
Specifications
CPU Support
Support Intel® Core™ i5-6300U processor
Main Memory
Dual 204-pin SO-DIMM sockets supports up to 32 GB DDR4 2133 MHz SDRAM
BIOS
AMI System BIOS
Plug and play support
Advanced Power Management and Advanced Configuration & Power Interface support
Display
Integrated Intel® Gen.8 Graphics Engine support
Triple independent display integrated GT1/GT2/GT3 to support: eDP + 2 x DDI (Support HDMI/DP/DVI)
COM Express Connector
AB:- HDA/2 x SATA 3.0/GbE/4 x PCIe x1/8 x USB 2.0/LPC bus/GPIO/SMBus (I2C)/SPI BIOS
CD:- 2 x DDI (Support HDMI/DP/DVI)- 4 x USB 3.0- 5 x PCIe x1 Gen.3
Power Requirements
+12VDC, +5Vsb
Support both AT and ATX power supply mode
One 3 pins 90 degree edge-connector for DC +12V fan
Dimensions
95mm (W) x 95mm (L)
Environment
Board level operating temperatures: -10°C to 60°C
Storage temperatures: -20°C to 85°C
Relative humidity:- 10% to 90% (operating, non-condensing)- 5% to 95% (non-operating, non-condensing)
Certifications
Meet CE/FCC Class B
Categorization Information
IoT Automation Solutions
Embedded Computing
Computer-on-Module
Features
- On-Board Intel® Core™ processor
- 2 channel DDR4 without ECC/SO-DIMMs 2133MHz up to 32GB
- Support three independent displays with eDP and 2 x DDI (Support HDMI/DP/DVI)
- Support eMMC 5.0 up to 16G
- 5 x PCIe x1, 4 x USB 3.0, 8 x USB 2.0, 3 x SATA 3.0 and GbE
- Support Windows 10
Datasheet
Extracted Text
® COMe Type 6, Compact Size Module with 6th Gen. Intel Core™ processor ICES 673 MCP solution, DDR4/ 5 x PCIe x 1/4 x USB3.0 / 3 x SATA3.0 and GbE Main F Main Features eatures ® Support eMMC 5.0 up to 16G On-Board Intel Core™ processor 5 x PCIe x1, 4 x USB 3.0, 8 x USB 2.0, 3 x SATA 3.0 and GbE 2 channel DDR4 without ECC/SO-DIMMs 2133MHz up to 32GB Support Windows 10 Support three independent displays with eDP and 2 x DDI (Support HDMI/DP/DVI) Product Overview ® The ICES 673 is a COM Express Type 6 compact size module which features Intel Core™ MCP processor (codename Skylake) and supports dual DDR4 ® SO-DIMM memory sockets with Non-ECC support, up to 32GB 2133MHz. It is integrated with Intel integration graphics for powerful graphics processing and through interfaces like eDP and 2 x DDI. This new ICES 673 supports triple displays, on board eMMC up to 16G, and advanced I/O interfaces such as 5 x PCI Express gen. 3, 3 x SATA3.0, and 8 x USB 2.0. Specifications CD: CPU Support ® - 2 x DDI (Support HDMI/DP/DVI) Support Intel Core™ i5-6300U processor - 4 x USB 3.0 Main Memory - 5 x PCIe x1 Gen.3 Dual 204-pin SO-DIMM sockets supports up to 32 GB DDR4 2133 MHz Power Requirements SDRAM +12VDC, +5Vsb BIOS Support both AT and ATX power supply mode AMI System BIOS One 3 pins 90 degree edge-connector for DC +12V fan Plug and play support Dimensions Advanced Power Management and Advanced Configuration & Power 95mm (W) x 95mm (L) Interface support Environment Display ® Integrated Intel Gen.8 Graphics Engine support Board level operating temperatures: -10°C to 60°C Triple independent display integrated GT1/GT2/GT3 to support: eDP Storage temperatures: -20°C to 85°C + 2 x DDI (Support HDMI/DP/DVI) Relative humidity: - 10% to 90% (operating, non-condensing) COM Express Connector - 5% to 95% (non-operating, non-condensing) AB : - HDA/2 x SATA 3.0/GbE/4 x PCIe x1/8 x USB 2.0/LPC bus/GPIO/ Certifications SMBus (I2C)/SPI BIOS Meet CE/FCC Class B COM Express COM Express connector C and D COM Express connector A and B www.nexcom.com Block Diagram DDR4 NON-ECC DDR4 NON-ECC DDR4 DDR4 DIMM0 DIMM0 DDR4 CHA DDR4 CHB EDP DISPLAY PORT 1 HDA BUS DISPLAY PORT 2 SATA BUS PORT:0 1 2 SKYLAKE-U 15W(2+2e) USB 3.0 BUS PORT 0 1 2 3 SPI BUS 28W(2+3e) 42 x 24 mm SPI BIOS TYPE3 LPC BUS SERIAL PORT:1.2 SDIO PCIE BUS EC SM BUS / I2C IT8528E/CX WDT GPIO 4IN/4OUT PCI-E x 1 BUS PORT:1,2,3,4,5 INTEL I219LM MDI BUS PCI-E x 1 BUS PORT:9 GbE PHY TYPE 6 USB 2.0 BUS PORT:0-7 TYPE 6 Ordering Information ICES 673 (P/N: 10K00067300X0) ® Intel Core™ i5-6300U processor, type 6 COM Express compact module, 2 x SO-DIMMs non-ECC DDR4 (2133MHz/32GB), 5 x PCIe x1, 3 x USB 3.0, 8 x USB 2.0, 2 x SATA 3.0, 1 x GbE, 1 x eDP, 2 x DDI (HDMI 1.4/DisplayPort 1.2/DVI) ® COM Express is a registered trademark of PICMG. COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 01/12/2016 LPC SPI SATA HDA DP USB 2.0 USB 3.0 DP PORT
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