NEXCOM ICES 268

Description
COM Express™ Type 2, Basic Module with QM77 Intel® 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family
The ICES 268 is a Type 2 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset supports Intel® 3rd generation Intel® Core™ i7/i5/i3 rPGA988 processors up to i7-3610QE (4x 2.3Ghz/ max. TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB.
Part Number
ICES 268
Price
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Manufacturer
NEXCOM
Lead Time
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Category
Embedded Computers » Computer-on-Module
Specifications
CPU Support
Support Intel® 3rd generation Core™ i7/i5/i3 embedded rPGA988processors– Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)– Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)– Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)
Main Memory
Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB
Platform Control Hub
Intel® QM77 PCH (option HM76) chipset
BIOS
AMI UEFI System BIOS
Plug and play support
Advanced Power Management and ACPI support
Display
Intel® HD graphics with DX11 support and supports Triple independent displays
One PCI Express x16 Lane (Gen 3.0) down to the carried board
Supports VGA, single/dual channels LVDS 18/24-bit interfaces
Optional 1x DDI port B support HDMI, DVI, DisplayPort and SDVO by PEG with EBK-A2HDMI
Audio
HD audio interface
On-board LAN
Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported by QM77 only)
Support boot from LAN, wake on LAN function
Signals down to I/O board
COM Express Connector
ABVGA/ LVDS/ 8x USB 2.0, HD Audio/ 2x SATA3.0, 2x SATA 2.0/ GbE/ GPIO/ LPC bus/ 5 x PCIex1/ SMBus (I2C)/ SPI BIOS / SPK out
CDPCIex16 (Gen. 3.0) / PCI (v2.3)/ IDE
Power Requirements
+12V, +5VSB, +3.3V RTC power
Dimensions
95mm (W) x 125mm (L)
Environment
Operating temperature: -15°C to 60°C
Storage temperature: -20°C to 80°C
Relative humidity: 10% to 90% (operating, non-condensing); 5% to 95% (non-operating, non-condensing)
Certifications
Meet CE
FCC Class A
Categorization Information
IoT Automation Solutions
Embedded Computing
Computer-on-Module
Features
- Intel® 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
- Intel® QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 Type 2, pin-outs
- Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB
- Support PCIex16 (Gen3.0), 5x PCIex1, 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and 1x GbE
- Support VGA, dual channels 18/24-bit LVDS and optional 1x DDI/ SDVO by PEG
- Dimension: 95mm (mm) x 125mm (L)
Datasheet
Extracted Text
COM Express™ Type 2, Basic Module with QM77 ® ® ICES 268 Intel 3rd Generation Intel Core™ rPGA988 Embedded Processors Family Main F Main Features eatures ® ® Support PCIex16 (Gen3.0), 5 x PCIex1, 8 x USB2.0, 2 x SATA3.0/2 x Intel 3rd generation Intel Embedded Core™ rPGA988 embedded SATA2.0 and 1 x GbE processors family ® Support VGA, dual channels 18/24-bit LVDS and optional 1 x DDI/ Intel QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 SDVO by PEG Type 2, pin-outs Dimension: 95mm (mm) x 125mm (L) Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB Product Overview ® ® ® The ICES 268 is a Type 2 COM Express Basic Module featuring Intel QM77 PCH (option HM76) chipset supports Intel 3rd generation Intel Core™ i7/i5/i3 rPGA988 processors up to i7-3610QE (4 x 2.3GHz/max. TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB. ® The 3rd Generation Core i7/i5/i3 processors integrated with Intel HD graphics with DX11 support one PCIex16 (Gen 3.0) to carrier board. The optional 1 x DDI interfaces port B, allows ICES 268 implement SDVO to HDMI, DVI, DP port by add-in EBK-A2HDMI. The high performance ICES 268 COM Express Basic Module supports 4 x SATA3.0/2.0, 8 x USB2.0, 5 x PCIex1 lanes and 1 x Gigabit Ethernet through the carrier board; NEXCOM is offering standard Type 2 carrier board, ICEB 8050C as well as hardware-ready evaluation starter-kit, ICEK 8050C-T2 build-in 10.4” LCD panel, Flex-ATX power supply to help device makers and equipment builders may evaluate full set of I/O function and add-in cards at early development stage. Specifications CPU Support Audio ® Support Intel 3rd generation Core™ i7/i5/i3 embedded rPGA988 HD audio interface processors On-board LAN ® - Intel Core™ i7-3610QE (4 x 2.3GHz/6MB cache/Max. TDP 45W) ® Intel 82579LM Gigabit Ethernet, support iAMT 8.0 (supported by ® - Intel Core™ i7-3610ME (2 x 2.7GHz/3MB cache/Max. TDP 35W) ® ® QM77 only) - Intel Celeron B810 (2 x 1.6GHz/2MB cache/Max. TDP 35W) Support boot from LAN, wake on LAN function Main Memory Signals down to I/O board Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB COM Express Connector Platform Control Hub AB ® Intel QM77 PCH (option HM76) chipset VGA/LVDS/8 x USB2.0, HD Audio/2 x SATA3.0, 2 x SATA 2.0/GbE/GPIO/ LPC bus/5 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out BIOS CD AMI UEFI System BIOS PCIex16 (Gen. 3.0)/PCI (v2.3)/IDE Plug and play support Advanced Power Management and ACPI support Power Requirements +12V, +5VSB, +3.3V RTC power Display ® Intel HD graphics with DX11 support and supports Triple Dimensions independent displays 95mm (W) x 125mm (L) One PCI Express x16 Lane (Gen 3.0) down to the carried board Environment Supports VGA, single/dual channels LVDS 18/24-bit interfaces Board level operating temperatures: -15°C to 60°C Optional 1 x DDI port B support HDMI, DVI, DisplayPort and SDVO by Storage temperatures: -20°C to 80°C PEG with EBK-A2HDMI COM Express COM Express connector C and D COM Express connector A and B www.nexcom.com Block Diagram DDR3 Channel A Sandy Bridge DDR3 1066/1333 MHz DIMM1 Vcore IMVP 7 GFXCORE 37.5 x 37.5 mm rPGA Socket(rPGA988B) PCIex16 BUS FDI DMI Flexible Display DMI(X4) Interface VGA BUS FDI DMI HDA BUS Cougar Point S ATA B US POR T: 0- 3 S ATA B US QM67 LVDS BUS SATA to IDE 25 x 25 mm SATA BUS SATA BUS PORT:4 FCBGA(Mobile only) 88SA8052B1 PORT:0-7 USB2.0 BUS LPC BUS PCI-E *1 (8) SPI BIOS PCI-E*1 BUS PORT:1,2,3,4,5,7 iAMT SPI ROM TYPE 2 PCIe to PCI TYPE 2 INTEL WG82579LM Bridge PCI-E*1 BUS PORT:6 PCI-E*1 BUS PORT:8 GbE PHY IT8892 Relative humidity: Ordering Information 10% to 90% (operating, non-condensing) 5% to 95% (non-operating, non-condensing) ICES 268 (P/N: 10K00026800X0) ® COM Express type 2, basic Module QM77 support Intel 3rd Certifications Generation Core™ rPGA988 embedded processors, non-ECC DDR3/2 Meet CE x SO-DIMMs FCC Class A ICES 268 F- kit (P/N: 10K00026801X0) COM Express Active fan kits with heat-spreader, heat-sink and cooling fan for ICES268 ICEB 8050C (P/N: 10KB0805001X0) COM Express Type 2, COM.0 Rev. 2.0 Evaluation CRB, VGA/LVDS/8 x USB2.0/2 x COM/GbE/LPT/5.1 HD/SPDIF, CF/IDE/mSATA/CFast/ PCIex16/PCIex4/PCIex1/PCI/mPCIe, ATX power input COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 03/05/2014 LPC USB (12) SATA HDA VGA LVDS DISPLAY DISPLAY SDVO SATA PCIex16 DDR3 CH A PORT C PORT D PORT B
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