Embedded Computers/Computer-on-Module

NEXCOM ICES 268

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Details

Part Number ICES 268
Manufacturer NEXCOM
Category Embedded Computers »  Computer-on-Module
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Description

COM Express™ Type 2, Basic Module with QM77 Intel® 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family
The ICES 268 is a Type 2 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset supports Intel® 3rd generation Intel® Core™ i7/i5/i3 rPGA988 processors up to i7-3610QE (4x 2.3Ghz/ max. TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB.

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Our Process: Preparation
Preparation

Once you accept your quote and confirm your order, we prepare by retrieving related parts and components from our inventory. Anything we do not currently have in stock is sourced.

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Receiving

Upon receipt, all parts are visually inspected for damage and then photographed to document their condition. Parts acquired from vendors must meet our quality standards.

Our Process: Initial Testing
Initial Testing

Industrial computer boards and other parts we are equipped to evaluate are tested to verify functionality and discover possible damage.

Our Process: Refurbishment
Refurbishment

Industrial computer boards have all components with low MTBF numbers (such as capacitors and connectors) replaced and are washed in our PCB cleaner to remove dust and grime.

Our Process: Repair
Repair

Industrial computer boards are fully diagnosed and repaired by our engineers. Logs of the problems encountered and solutions implemented are recorded.

Our Process: Final Testing
Final Testing

Industrial computer boards have all I/O connections rigorously tested to ensure that everything is working properly before the board is certified as ready to ship.

Our Process: Shipping
Shipping

After photos are taken to document the exterior condition of the part, it is packaged and sent to the customer. ESD-safe materials are used to protect sensitive equipment on its journey.

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IPC Station is a website of GID Industrial, an ISO 9001:2015-certified company that has specialized in servicing industrial computer boards and providing other industrial products for sectors including manufacturing, defense, aerospace, entertainment, healthcare, and more by utilizing our combined skills and vast international network of trusted suppliers since our founding in 2015.

Do you need an ICES 268? We can help you find it at a competitive price!

Specifications

CPU Support Support Intel® 3rd generation Core™ i7/i5/i3 embedded rPGA988processors– Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)– Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)– Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)
Main Memory Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB
Platform Control Hub Intel® QM77 PCH (option HM76) chipset
BIOS AMI UEFI System BIOS
Plug and play support
Advanced Power Management and ACPI support
Display Intel® HD graphics with DX11 support and supports Triple independent displays
One PCI Express x16 Lane (Gen 3.0) down to the carried board
Supports VGA, single/dual channels LVDS 18/24-bit interfaces
Optional 1x DDI port B support HDMI, DVI, DisplayPort and SDVO by PEG with EBK-A2HDMI
Audio HD audio interface
On-board LAN Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported by QM77 only)
Support boot from LAN, wake on LAN function
Signals down to I/O board
COM Express Connector ABVGA/ LVDS/ 8x USB 2.0, HD Audio/ 2x SATA3.0, 2x SATA 2.0/ GbE/ GPIO/ LPC bus/ 5 x PCIex1/ SMBus (I2C)/ SPI BIOS / SPK out
CDPCIex16 (Gen. 3.0) / PCI (v2.3)/ IDE
Power Requirements +12V, +5VSB, +3.3V RTC power
Dimensions 95mm (W) x 125mm (L)
Environment Operating temperature: -15°C to 60°C
Storage temperature: -20°C to 80°C
Relative humidity: 10% to 90% (operating, non-condensing); 5% to 95% (non-operating, non-condensing)
Certifications Meet CE
FCC Class A
Categorization Information IoT Automation Solutions
Embedded Computing
Computer-on-Module

Features

  • Intel® 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
  • Intel® QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 Type 2, pin-outs
  • Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB
  • Support PCIex16 (Gen3.0), 5x PCIex1, 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and 1x GbE
  • Support VGA, dual channels 18/24-bit LVDS and optional 1x DDI/ SDVO by PEG
  • Dimension: 95mm (mm) x 125mm (L)

Datasheet

Download "7d65a38d-805f-47de-aa4f-17efc8544b67.pdf" (760 KiB)

Extracted Text

COM Express™ Type 2, Basic Module with QM77 ® ® ICES 268 Intel 3rd Generation Intel Core™ rPGA988 Embedded Processors Family Main F Main Features eatures ® ® Œ Support PCIex16 (Gen3.0), 5 x PCIex1, 8 x USB2.0, 2 x SATA3.0/2 x Œ Intel 3rd generation Intel Embedded Core™ rPGA988 embedded SATA2.0 and 1 x GbE processors family ® Œ Support VGA, dual channels 18/24-bit LVDS and optional 1 x DDI/ Œ Intel QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 SDVO by PEG Type 2, pin-outs Œ Dimension: 95mm (mm) x 125mm (L) Œ Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB Product Overview ® ® ® The ICES 268 is a Type 2 COM Express Basic Module featuring Intel QM77 PCH (option HM76) chipset supports Intel 3rd generation Intel Core™ i7/i5/i3 rPGA988 processors up to i7-3610QE (4 x 2.3GHz/max. TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB. ® The 3rd Generation Core i7/i5/i3 processors integrated with Intel HD graphics with DX11 support one PCIex16 (Gen 3.0) to carrier board. The optional 1 x DDI interfaces port B, allows ICES 268 implement SDVO to HDMI, DVI, DP port by add-in EBK-A2HDMI. The high performance ICES 268 COM Express Basic Module supports 4 x SATA3.0/2.0, 8 x USB2.0, 5 x PCIex1 lanes and 1 x Gigabit Ethernet through the carrier board; NEXCOM is offering standard Type 2 carrier board, ICEB 8050C as well as hardware-ready evaluation starter-kit, ICEK 8050C-T2 build-in 10.4” LCD panel, Flex-ATX power supply to help device makers and equipment builders may evaluate full set of I/O function and add-in cards at early development stage. Specifications CPU Support Audio ® Œ Support Intel 3rd generation Core™ i7/i5/i3 embedded rPGA988 Œ HD audio interface processors On-board LAN ® - Intel Core™ i7-3610QE (4 x 2.3GHz/6MB cache/Max. TDP 45W) ® Œ Intel 82579LM Gigabit Ethernet, support iAMT 8.0 (supported by ® - Intel Core™ i7-3610ME (2 x 2.7GHz/3MB cache/Max. TDP 35W) ® ® QM77 only) - Intel Celeron B810 (2 x 1.6GHz/2MB cache/Max. TDP 35W) Œ Support boot from LAN, wake on LAN function Main Memory Œ Signals down to I/O board Œ Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB COM Express Connector Platform Control Hub Œ AB ® Œ Intel QM77 PCH (option HM76) chipset VGA/LVDS/8 x USB2.0, HD Audio/2 x SATA3.0, 2 x SATA 2.0/GbE/GPIO/ LPC bus/5 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out BIOS Œ CD Œ AMI UEFI System BIOS PCIex16 (Gen. 3.0)/PCI (v2.3)/IDE Œ Plug and play support Œ Advanced Power Management and ACPI support Power Requirements Œ +12V, +5VSB, +3.3V RTC power Display ® Œ Intel HD graphics with DX11 support and supports Triple Dimensions independent displays Œ 95mm (W) x 125mm (L) Œ One PCI Express x16 Lane (Gen 3.0) down to the carried board Environment Œ Supports VGA, single/dual channels LVDS 18/24-bit interfaces Œ Board level operating temperatures: -15°C to 60°C Œ Optional 1 x DDI port B support HDMI, DVI, DisplayPort and SDVO by Œ Storage temperatures: -20°C to 80°C PEG with EBK-A2HDMI COM Express COM Express connector C and D COM Express connector A and B www.nexcom.com Block Diagram DDR3 Channel A Sandy Bridge DDR3 1066/1333 MHz DIMM1 Vcore IMVP 7 GFXCORE 37.5 x 37.5 mm rPGA Socket(rPGA988B) PCIex16 BUS FDI DMI Flexible Display DMI(X4) Interface VGA BUS FDI DMI HDA BUS Cougar Point S ATA B US POR T: 0- 3 S ATA B US QM67 LVDS BUS SATA to IDE 25 x 25 mm SATA BUS SATA BUS PORT:4 FCBGA(Mobile only) 88SA8052B1 PORT:0-7 USB2.0 BUS LPC BUS PCI-E *1 (8) SPI BIOS PCI-E*1 BUS PORT:1,2,3,4,5,7 iAMT SPI ROM TYPE 2 PCIe to PCI TYPE 2 INTEL WG82579LM Bridge PCI-E*1 BUS PORT:6 PCI-E*1 BUS PORT:8 GbE PHY IT8892 Œ Relative humidity: Ordering Information Œ 10% to 90% (operating, non-condensing) Œ 5% to 95% (non-operating, non-condensing) Œ ICES 268 (P/N: 10K00026800X0) ® COM Express type 2, basic Module QM77 support Intel 3rd Certifications Generation Core™ rPGA988 embedded processors, non-ECC DDR3/2 Œ Meet CE x SO-DIMMs Œ FCC Class A Œ ICES 268 F- kit (P/N: 10K00026801X0) COM Express Active fan kits with heat-spreader, heat-sink and cooling fan for ICES268 Œ ICEB 8050C (P/N: 10KB0805001X0) COM Express Type 2, COM.0 Rev. 2.0 Evaluation CRB, VGA/LVDS/8 x USB2.0/2 x COM/GbE/LPT/5.1 HD/SPDIF, CF/IDE/mSATA/CFast/ PCIex16/PCIex4/PCIex1/PCI/mPCIe, ATX power input COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 03/05/2014 LPC USB (12) SATA HDA VGA LVDS DISPLAY DISPLAY SDVO SATA PCIex16 DDR3 CH A PORT C PORT D PORT B

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