Manufacturers
NEXCOM ICES 501X
Description
COM Express Type 10 Mini Module with Intel® AtomTM Processor E3800 Series DDR3L Memory Down/1GbE/2SATA/4 x PCIe/DDI/USB 2.0/USB 3.0
The ICES 510X is a COM express® Type 10 mini size module that features Intel® Atom™ Quad-Core processor Bay-trail-I SOC solution. DDR3L Memory down chips 1066 / 1333MHz up to 4GB. The ICES 501X integrates with Intel® Gen7 Graphic engine to support dual displays of LVDS resolution up to 1366 x 768 resolutions and 1DP link with HDMI1.4a / DP1.2 configurations. The high performance ICES 501X COM Express module supports SATA, USB 2.0 & USB 3.0 / VGA / DP (HDMI) / PCIE x1.
Part Number
ICES 501X
Price
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Manufacturer
NEXCOM
Lead Time
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Category
Embedded Computers » Computer-on-Module
Specifications
CPU Support
Intel® Atom™ quad core Bay-trail-I SOC up to 1.91GHz
Main Memory
DDR3L memory down 1066/1333MHz memory up to 4GB
BIOS
AMI system BIOS
Plug and play support
Advanced power management and advanced configuration & power interface support
Display
Intel® HD graphics with DX9 support
One DP interfaces down to the carried board
LVDS 18/24 bit interface
Audio
HD audio interface
On-board LAN
Intel® I210 GbE controller, support boot from LAN, wake on LAN
Support PXE boot from LAN, wake on LAN function
Signals down to I/O board
Onboard-Storage
Optional 4GB or 8GB: Micron EMMC chip on board
COM Express Connector
LVDS/HDA/2 x SATA/GbE/4PCIE x 1(Optional Port 4 if LAN is disabled)/7 x USB 2.0/1 x USB 3.0
LPC bus / GPIO / SMBus (I2C)/ SPI BIOS
Power Requirements
+12V, VCC5,VCC3, VCORE, 5VSB Voltage detection
Support both AT and ATX Power supply mode
Dimensions
84mm (W) x 55mm (L)
Environment
Board level operating temperatures: -40°C to 85°C
Storage temperatures: -40°C to 85°C
Relative humidity:- 10% to 90% (operating, non-condensing)- 5% to 95% (non-operating, non-condensing)
Certifications
Meet CE
FCC class B
Categorization Information
IoT Automation Solutions
Embedded Computing
Computer-on-Module
Features
- Embedded Intel® Aton Bay-trail-I SOC chip with 4 core support
- Embedded controller built in with EAPI support
- Support DDR3L memory down 1066/1333MHz up to 4GBytes
- Support onboard EMMC up to 8GBytes
- Support 4PCIe x1(Optional Port 4 if LAN is disabled)/1x USB 3.0/7x USB 2.0/2x SATA 2.0 and GbE
- 1x DP/ LVDS interfaces
- Dimension 84x 55mm (W x L)
Datasheet
Extracted Text
® TM COM Express Type 10 Mini Module with Intel Atom Processor E3800 Series ICES 501X DDR3L Memory Down/1GbE/2SATA/4 x PCIe/DDI/USB 2.0/USB 3.0 Main F Main Features eatures ® Support 4PCIe x1(Optional Port 4 if LAN is disabled)/1x USB 3.0/ Embedded Intel Aton Bay-trail-I SOC chip with 4 core support 7x USB 2.0/2x SATA 2.0 and GbE Embedded controller built in with EAPI support 1x DP/ LVDS interfaces Support DDR3L memory down 1066/1333MHz up to 4GBytes Dimension 84x 55mm (W x L) Support onboard EMMC up to 8GBytes Product Overview ® ® The ICES 510X is a COM Express Type 10 mini size module that features Intel Atom™ Quad-Core processor Bay-trail-I SOC solution. DDR3L Memory ® down chips 1066 / 1333MHz up to 4GB. The ICES 501X integrates with Intel Gen7 Graphic engine to support dual displays of LVDS resolution up to 1366 x 768 resolutions and 1DP link with HDMI1.4a / DP1.2 configurations. The high performance ICES 501X COM Express module supports SATA, USB 2.0 & USB 3.0 / VGA / DP (HDMI) / PCIE x 1. Specifications CPU Support Onboard-Storage ® Intel Atom™ quad core Bay-trail-I SOC up to 1.91GHz. Optional 4GB or 8GB: Micron EMMC chip on board Main Memory COM Express Connector DDR3L memory down 1066/1333MHz memory up to 4GB LVDS/HDA/2 x SATA/GbE/4PCIE x 1(Optional Port 4 if LAN is disabled) /7 x USB 2.0/1 x USB 3.0 BIOS LPC bus / GPIO / SMBus (I2C)/ SPI BIOS AMI system BIOS Plug and play support Power Requirements Advanced power management and advanced configuration & power +12V, VCC5,VCC3, VCORE, 5VSB Voltage detection interface support Support both AT and ATX Power supply mode Display Dimensions ® Intel HD graphics with DX9 support 84mm (W) x 55mm (L) One DP interfaces down to the carried board Environment LVDS 18/24 bit interface Board level operating temperatures: -40°C to 85°C Audio Storage temperatures: -40°C to 85°C HD audio interface Relative humidity: - 10% to 90% (operating, non-condensing) On-board LAN - 5% to 95% (non-operating, non-condensing) ® Intel I210 GbE controller, support boot from LAN, wake on LAN Support PXE boot from LAN, wake on LAN function Certifications Signals down to I/O board Meet CE FCC class B COM Express www.nexcom.com Block Diagram PCIe x3 (Port 1-3) / PCIe x4 (Port 0-3) (Option) MDIO SPI DDI (DP/HDMI/DVI) DDI PORT0 DDR3L CH0 DDR3L MEMORY DOWN non-ECC SDRAM 8 chips CH7511 LVDS CH-A eDP eDP to LVDS (Option) BIOS ROM SPI SPI 8MB Bay Trail-I USB 3.0 x1 Qual Core CPU E3845/E3826 USB 2.0 x3 LAN I210-IT PCIe x1 (Port 0) DDR3L-1066 10/100/1000Mbps 5W-10W GL852GT USB 2.0 x4 USB 2.0 x1 (Option) USB2.0 Hub 25X27mm PCIe x3 (Port 1-3) SATA-II Port0 eMMC MMC 4GB/8GB SATA-II Port1 HDA SD LPC HD Audio x1 LPC GPIO x8 / SDIO (Option) Embedded WDT Controller UART x2 (TX/RX) ITE8528 Ordering Information ICES501X-E3845 (P/N: TBD) COM Express type 10 Compact Module Extended -40°C to + 85°C with ® Intel Atom™ processor E3845/4C, 1.91GHz /DDR3L memory down with 4GByte SIZE/Onboard 8GBytes eMMC with PCIe/HDMI/LVDS/ SATA/GBe ICES501X-E3826 (P/N: TBD) COM Express type 10 Compact Module Extended -40°C to + 85°C with ® Intel Atom™ processor E3826/2C, 1.46GHz /DDR3L Memory down with 2GBytes/Onboard 4GBytes eMMC with PCIe/HDMI/LVDS/SATA/ GbE ® COM Express is a registered trademark of PICMG. COM Express W We reser e reserve the right to change specifications and product descriptions at any time without prior notice. ve the right to change specifications and product descriptions at any time without prior notice. Last update: 02/06/2015 Last update: 02/06/2015 COM Express Connector A/B - Type 10 SATA (2) USB 2.0 (4) USB 3.0 (1) DDI PORT1 VGA SDIO LPC DDR3L 1066 MMC PCI-E *1 (4) SPI CH1 CH0
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