NEXCOM ICES 267

Description
COM Express Type 2 Basic Module Support Intel® Socket rPGA 988, 2nd Generation Core™ Mobile Processor Family
The ICES 267 is a COM Express Type 2 basic module featuring Intel® QM67/HM65 Platform Control Hub, switch supports 2nd generation Intel® Core™ Mobile processors and one DDR3 SO-DIMM memory socket up to 8GB. The ICES 267 integrated with Intel® HD graphics or expands via PCI Express Graphic 1x 16 lane to carrier board; it also supports other display types include LFP or Dual channel LVDS. The high performance ICES 267 COM Express Module supports 4x SATA, 8x USB2.0 and 6X PCIe x1 lanes through the carrier board. It is compatible with ICEB 8050 carrier board and in-house designed ICES 267 F-kits from NEXCOM.
Part Number
ICES 267
Price
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Manufacturer
NEXCOM
Lead Time
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Category
Embedded Computers » Computer-on-Module
Specifications
CPU Support
Support 2nd generation Intel® Core™ processor family, rPGA 988
Main Memory
One DDR3 1066/1333 MHz SO-DIMM, up to 8GB
Platform Control Hub
QM67/ HM65
BIOS
AMI System BIOS
Plug and play support
Display
Intel® HD graphics solution
One PCI Express X 16 Lane down to the carried board
Drive a standard progressive scan analog monitor with resolution up to 2048 x 1536 @ 60Hz
Supports LVDS 18/24-bit & single/dual channel interface
Audio
HD audio interface
On-board LAN
Intel® 82579LM Gigabit Ethernet, support iAMT 7.0 (supported with QM67 only)
Support boot from LAN, wake on LAN function
Signals down to I/O board
COM Express Connector
ABVGA/ LVDS/ 8 x USB 2.0/ HD Audio/ 3 x SATA/ LAN/ GPIO/ LPC bus One PCIe X4/ two PCIe X1/ SMBus (I2C)/ SPI BIOS
CDPCIe x 16/ IDE/ PCI
Power Requirements
+12V, +5VSB, +3.3V RTC power
Dimensions
95mm (W) x 125mm (L)
Environment
Board Level Operating temperatures: -15°C to 60°C
Storage temperatures: -20°C to 80°C
Relative humidity: 10% to 90% (operating, non-condensing); 5% to 95% (non-operating, non-condensing)
Certifications
CE approval
FCC Class A
Categorization Information
IoT Automation Solutions
Embedded Computing
Computer-on-Module
Features
- 2nd Generation Intel® Core™ Mobile Processors
- Intel® QM67/HM65 PCH
- 1x DDR3 SO-DIMM socket support non-ECC DDR3 800/1066/1333MHz up to 8GB
- Type 2 COM Express Module Support 6 Express Lanes, 32 bit PCI Interface, One IDE and Gigabit LAN
Datasheet
Extracted Text
® COM Express Type 2 Basic Module Support Intel Socket rPGA 988, TM ICES 267 2nd Generation Core Mobile Processor Family Main Features ® Type 2 COM Express Module Support 6 Express Lanes, 32 bit PCI 2nd Generation Intel Core™ Mobile Processors ® Interface, One IDE and Gigabit LAN Intel QM67/HM65 PCH 1x DDR3 SO-DIMM socket support non-ECC DDR3 800/1066/1333MHz up to 8GB Product Overview ® ® The ICES 267 is a COM Express Type 2 basic module featuring Intel QM67/HM65 Platform Control Hub, switch supports 2nd generation Intel Core™ ® Mobile processors and one DDR3 SO-DIMM memory socket up to 8GB. The ICES 267 integrated with Intel HD graphics or expands via PCI Express Graphic 1x 16 lane to carrier board; it also supports other display types include LFP or Dual channel LVDS. The high performance ICES 267 COM Express Module supports 4x SATA, 8x USB2.0 and 6X PCIe x1 lanes through the carrier board. It is compatible with ICEB 8050 carrier board and in-house designed ICES 267 F-kits from NEXCOM. Specifications CPU Support Audio ® Support 2nd generation Intel Core™ processor family, rPGA 988 HD audio interface ® Processor i5-2510E i3-2330E Celeron B810 On-board LAN ® # of Core 2 2 2 Intel 82579LM Gigabit Ethernet, support iAMT 7.0 (supported with Clock Speed 2.5GHz 2.2GHz 1.6GHz QM67 only) Max. TDP 35W 35W 35W Support boot from LAN, wake on LAN function Signals down to I/O board Main Memory One DDR3 1066/1333 MHz SO-DIMM, up to 8GB COM Express Connector AB Platform Control Hub VGA/ LVDS/ 8x USB 2.0/ HD Audio/ 3x SATA/ LAN/ GPIO/ LPC bus QM67/ HM65 One PCIe X4/ two PCIe X1/ SMBus (I2C)/ SPI BIOS BIOS CD AMI System BIOS PCIe x16/ IDE/ PCI Plug and play support Power Requirements Display +12V, +5VSB, +3.3V RTC power ® Intel HD graphics solution Dimensions One PCI Express X 16 Lane down to the carried board 95mm (W) x 125mm (L) Drive a standard progressive scan analog monitor with resolution up to 2048 x 1536 @ 60Hz Supports LVDS 18/24-bit & single/dual channel interface COM Express COM Express connector C and D COM Express connector A and B www.nexcom.com Block Diagram Sandy Bridge DDR3 Channel A DDR3 1066/1333 MHz DIMM1 Vcore IMVP 7 GFXCORE 37.5 x 37.5 mm rPGA Socket(rPGA988B) PCIex16 BUS FDI DMI Flexible Display DMI(X4) Interface VGA BUS FDI DMI HDA BUS Cougar Point SATA BUS PORT:0-3 SATA BUS QM67 LVDS BUS 25 x 25 mm SATA to IDE SATA BUS SATA BUS PORT:4 FCBGA(Mobile only) 88SA8052B1 PORT:0-7 USB2.0 BUS LPC BUS PCI-E *1 (8) SPI BIOS PCI-E*1 BUS PORT:1,2,3,4,5,7 iAMT SPI ROM TYPE 2 PCIe to PCI TYPE 2 INTEL WG82579LM Bridge PCI-E*1 BUS PORT:6 PCI-E*1 BUS PORT:8 GbE PHY IT8892 Environment Ordering Information Board Level Operating temperatures: -15°C to 60°C Storage temperatures: -20°C to 80°C ICES 267 (P/N:10K00026700X0) Relative humidity: ® COM Express Type 2 basic module support Intel Socket rPGA 988, 10% to 90% (operating, non-condensing) TM 2nd generation Core mobile processor family, DDR3/ PCEe x16/ PCI/ 5% to 95% (non-operating, non-condensing) IDE/ GbE/ LVDS/ audio interface Certifications ICEB 8050C (P/N: 10KB0805000X00) CE approval COM Express Type 2 R2.0 evaluation board with PCIe/ PCI/ SATA/ FCC Class A CF/ mPCIe/ IDE/ COM/ USB/ VGA/ GbE and bootable from cFAST or Mini-SATA. ICES 267 F-Kit (P/N: 10K00026706X00) Active Fan Kits with heat-spreader, heat-sink and Cooling fan in-house designed for ICES267 COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 02/08/2013 USB (12) LPC LVDS SATA HDA VGA SDVO DISPLAY DISPLAY SATA PCIex16 DDR3 CH A PORT C PORT D PORT B
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