Embedded Computers/Computer-on-Module

NEXCOM ICES 671

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Details

Part Number ICES 671
Manufacturer NEXCOM
Category Embedded Computers »  Computer-on-Module
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Description

COM Express Type 6, COMPACT Size Module with 4th Gen. Intel® Core™ i7/i5/i3 processors MCP solution, DDR3L/GbE/4SATA/4 x PCIex1/DP/2 x USB3.0
The ICES 671 is a COM Express Type 6 compact size module that features 4th generation Intel® Core™ i7/i5/i3 or Celeron® FCBGA1168 processor and dual DDR3L SO-DIMM memory socket 1600Mhz without ECC support, up to 16 GB. ICES670 is COM Express Type 6 pin-outs, compact module (95 x 95mm) to follow COM.0 Rev. 2.0, This new ICES671 supports dual DDR3L (without ECC) SO-DIMM (1600MHz) up to 16 GB, and advanced I/O interfaces such as PCI Express gen 2.0, 4 x SATA3.0, and 2 x USB3.0. ICES671 is integrated with Intel GT1/GT2/GT3 Integration graphic for powerful graphic processing and three-display capability through display interfaces like HDMI/DVI/Display Port/CRT, and dual channels LVDS. The Compact size COMe express module of ICES671 applied latest Intel shark bay-U MCP solution with lower power TDP(15W) and highest graphic and computing performance, which is ideal for application with high graphic requirement and multiple display connectivity, such as medical, digital signage, automation and surveillance applications.

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Our Process

Our Process: Preparation
Preparation

Once you accept your quote and confirm your order, we prepare by retrieving related parts and components from our inventory. Anything we do not currently have in stock is sourced.

Our Process: Receiving
Receiving

Upon receipt, all parts are visually inspected for damage and then photographed to document their condition. Parts acquired from vendors must meet our quality standards.

Our Process: Initial Testing
Initial Testing

Industrial computer boards and other parts we are equipped to evaluate are tested to verify functionality and discover possible damage.

Our Process: Refurbishment
Refurbishment

Industrial computer boards have all components with low MTBF numbers (such as capacitors and connectors) replaced and are washed in our PCB cleaner to remove dust and grime.

Our Process: Repair
Repair

Industrial computer boards are fully diagnosed and repaired by our engineers. Logs of the problems encountered and solutions implemented are recorded.

Our Process: Final Testing
Final Testing

Industrial computer boards have all I/O connections rigorously tested to ensure that everything is working properly before the board is certified as ready to ship.

Our Process: Shipping
Shipping

After photos are taken to document the exterior condition of the part, it is packaged and sent to the customer. ESD-safe materials are used to protect sensitive equipment on its journey.

Who We Are

IPC Station is a website of GID Industrial, an ISO 9001:2015-certified company that has specialized in servicing industrial computer boards and providing other industrial products for sectors including manufacturing, defense, aerospace, entertainment, healthcare, and more by utilizing our combined skills and vast international network of trusted suppliers since our founding in 2015.

Do you need an ICES 671? We can help you find it at a competitive price!

Specifications

CPU Support 4th generation Intel® Core™ i7/i5/i3 processor MCP
Main Memory Dual DDR3L/SO-DIMMs, without ECC support 1600MHz memory up to 16GB
BIOS AMI UEFI BIOS
Plug and play support
Advanced Power Management and Advanced Configuration & Power Interface support
Display Intel® HD Graphic /GT1/GT2/GT3 with DX 11.1, OGL 3.2, OCL 1.2 support
Single and dual channel 18/24 LVDS
VGA interface (1920 x 1200)
DDI 1 with HDMI/DP/DVI support (DDI2: optional)
Audio HD audio interface
On-board LAN Intel® I218LM GbE controller, support boot from LAN, wake on LAN
Support PXE boot from LAN, wake on LAN function
Signals down to I/O board
COM Express Connector AB:VGA/LVDS/HDA/4 X SATA/GbE/4 x PCIex1/8 X USB2.0LPC bus/GPIO/SMBus (I2C)/SPI BIOS
CD:2 x USB3.0/2 x DDI (DDI2 Optional)
Power Requirements +12V, +5VSB, +3.3V RTC power
Support both AT and ATX power supply mode
One 3 pins 90 degree edge-connector for DC +12V fan
Dimensions 95mm (W) x 95mm (L)
Environment Board level operating temperatures: -15°C to 60°C
Storage temperatures: -20°C to 80°C
Relative humidity:10% to 90% (operating, non-condensing)5% to 95% (non-operating, non-condensing)
Certifications Meet CE/FCC Class B
Categorization Information IoT Automation Solutions
Embedded Computing
Computer-on-Module

Features

  • 4th gen. Intel® Core™ i7/i5/i3 processor (co-layout with boardwell MCP)
  • Triple independent display integrated GT1/GT2/GT3 to support: VGA, dual 18-/24 LVDS, HDMI, DP, DVI
  • Dual DDR3L/SO-DIMm (1600Mhz) up to 16GB without ECC memory support
  • Up to 2 x USB3.0/8 X USB2.0/4 x SATA 3.0/4 x PCIex1/WDT/GPIO/I2C
  • Dimension 95 x 95mm (W x L)

Datasheet

Download "88cf86c3-b3f3-4591-96c8-8fcda951973d.pdf" (668 KiB)

Extracted Text

® COM Express Type 6, COMPACT Size Module with 4th Gen. Intel Core™ i7/i5/i3 processors ICES 671 MCP solution, DDR3L/GbE/4SATA/4 x PCIex1/DP/2 x USB3.0 Main F Main Features eatures ® Œ Up to 2 x USB3.0/8 X USB2.0/4 x SATA 3.0/4 x PCIex1/WDT/GPIO/ Œ 4th gen. Intel Core™ i7/i5/i3 processor ( co-layout with boardwell MCP) I2C Œ Triple independent display integrated GT1/GT2/GT3 to support: Œ Dimension 95 x 95mm (W x L) VGA, dual 18-/24 LVDS, HDMI, DP, DVI Œ Dual DDR3L/SO-DIMm (1600Mhz) up to 16GB without ECC memory support Product Overview ® ® The ICES 671 is a COM Express Type 6 compact size module that features 4th generation Intel Core™ i7/i5/i3 or Celeron FCBGA1168 processor and dual DDR3L SO-DIMM memory socket 1600Mhz without ECC support, up to 16 GB. ICES670 is COM Express Type 6 pin-outs, compact module (95 x 95mm) to follow COM.0 Rev. 2.0, This new ICES671 supports dual DDR3L (without ECC) SO-DIMM (1600MHz) up to 16 GB, and advanced I/O interfaces such as PCI Express gen 2.0, 4 x SATA3.0, and 2 x USB3.0. ICES671 is integrated with Intel GT1/GT2/GT3 Integration graphic for powerful graphic processing and three-display capability through display interfaces like HDMI/DVI/Display Port/CRT, and dual channels LVDS. The Compact size COMe express module of ICES671 applied latest Intel shark bay-U MCP solution with lower power TDP(15W) and highest graphic and computing performance, which is ideal for application with high graphic requirement and multiple display connectivity, such as medical, digital signage, automation and surveillance applications. Specifications Œ Signals down to I/O board CPU Support ® Œ 4th generation Intel Core™ i7/i5/i3 processor MCP COM Express Connector Œ AB : Main Memory VGA/LVDS/HDA/4 X SATA/GbE/4 x PCIex1/8 X USB2.0 Œ Dual DDR3L/SO-DIMMs, without ECC support 1600MHz memory up LPC bus/GPIO/SMBus (I2C)/SPI BIOS to 16GB Œ CD : BIOS 2 x USB3.0/2 x DDI (DDI2 Optional) Œ AMI UEFI BIOS Power Requirements Œ Plug and play support Œ +12V, +5VSB, +3.3V RTC power Œ Advanced Power Management and Advanced Configuration & Power Œ Support both AT and ATX power supply mode Interface support Œ One 3 pins 90 degree edge-connector for DC +12V fan Display ® Dimensions Œ Intel HD Graphic /GT1/GT2/GT3 with DX 11.1 , OGL 3.2, OCL 1.2 Œ 95mm (W) x 95mm (L) support Œ Single and dual channel 18/24 LVDS Environment Œ VGA interface (1920 x 1200) Œ Board level operating temperatures: -15°C to 60°C Œ DDI 1 with HDMI/DP/DVI support ( DDI2: optional) Œ Storage temperatures: -20°C to 80°C Œ Relative humidity: Audio 10% to 90% (operating, non-condensing) Œ HD audio interface 5% to 95% (non-operating, non-condensing) On-board LAN ® Certifications Œ Intel I218LM GbE controller, support boot from LAN, wake on LAN Œ Meet CE/FCC Class B Œ Support PXE boot from LAN, wake on LAN function COM Express COM Express connector C and D DDR3 CH A DDR3 CH B Display Port1 Display Port2 USB3.0 Boardwell MCP 40 x 24 mm (BGA1168) SATA3(4) LPC SPI HDA SDIO I2C SMB PCIEx4 COM Express connector A and B www.nexcom.com Block Diagram IMVP 12.6 CH7511B 2 CH LVDS eDPX2 CORE PWR eDP PORT:0-3 SATA BUS DDR3L 1600 MHz DDR3 Channel A DIMM0 LPC BUS SERIAL PORT:1.2 EC IT8528E/CX DDR3L 1600 MHz DDR3 Channel B DIMM1 SPI BUS SPI BIOS HDA BUS DISPLAY PORT B DISPLAY PORT C CH7517 VGA BUS PCI-E*1 BUS PORT:1,2,3,4,5,7 USB3.0 BUS PORT:0-3 PORT:8 PCIE*1 BUS TYPE 6 INTEL I218LM MDI BUS PCI-E*1 BUS PORT:6 GbE PHY TYPE 6 SMBUS PORT:0-7 USB2.0 BUS Ordering Information Œ ICES 671-4300U (P/N: TBD) ® COM Express Type 6 Compact module with 4th generation Intel Core™ i7/i5/i3 processor MCP/2C, 1.9GHz/DDR3L without ECC/PCIe/ HDMI/VGA/SATA/GBE Œ ICES 671-2980U (P/N: TBD) ® COM Express Type 6 Compact module with 4th generation Intel Core™ i7/i5/i3 processor MCP/2C, 1.6GHz/DDR3L without ECC/PCIe/ HDMI/VGA/SATA/GBE COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 03/05/2014 VCCIN USB2.0 PCIEx1(4)

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