® COM Express Type 6, COMPACT Size Module with 4th Gen. Intel Core™ i7/i5/i3 processors ICES 671 MCP solution, DDR3L/GbE/4SATA/4 x PCIex1/DP/2 x USB3.0 Main F Main Features eatures ® Œ Up to 2 x USB3.0/8 X USB2.0/4 x SATA 3.0/4 x PCIex1/WDT/GPIO/ Œ 4th gen. Intel Core™ i7/i5/i3 processor ( co-layout with boardwell MCP) I2C Œ Triple independent display integrated GT1/GT2/GT3 to support: Œ Dimension 95 x 95mm (W x L) VGA, dual 18-/24 LVDS, HDMI, DP, DVI Œ Dual DDR3L/SO-DIMm (1600Mhz) up to 16GB without ECC memory support Product Overview ® ® The ICES 671 is a COM Express Type 6 compact size module that features 4th generation Intel Core™ i7/i5/i3 or Celeron FCBGA1168 processor and dual DDR3L SO-DIMM memory socket 1600Mhz without ECC support, up to 16 GB. ICES670 is COM Express Type 6 pin-outs, compact module (95 x 95mm) to follow COM.0 Rev. 2.0, This new ICES671 supports dual DDR3L (without ECC) SO-DIMM (1600MHz) up to 16 GB, and advanced I/O interfaces such as PCI Express gen 2.0, 4 x SATA3.0, and 2 x USB3.0. ICES671 is integrated with Intel GT1/GT2/GT3 Integration graphic for powerful graphic processing and three-display capability through display interfaces like HDMI/DVI/Display Port/CRT, and dual channels LVDS. The Compact size COMe express module of ICES671 applied latest Intel shark bay-U MCP solution with lower power TDP(15W) and highest graphic and computing performance, which is ideal for application with high graphic requirement and multiple display connectivity, such as medical, digital signage, automation and surveillance applications. Specifications Œ Signals down to I/O board CPU Support ® Œ 4th generation Intel Core™ i7/i5/i3 processor MCP COM Express Connector Œ AB : Main Memory VGA/LVDS/HDA/4 X SATA/GbE/4 x PCIex1/8 X USB2.0 Œ Dual DDR3L/SO-DIMMs, without ECC support 1600MHz memory up LPC bus/GPIO/SMBus (I2C)/SPI BIOS to 16GB Œ CD : BIOS 2 x USB3.0/2 x DDI (DDI2 Optional) Œ AMI UEFI BIOS Power Requirements Œ Plug and play support Œ +12V, +5VSB, +3.3V RTC power Œ Advanced Power Management and Advanced Configuration & Power Œ Support both AT and ATX power supply mode Interface support Œ One 3 pins 90 degree edge-connector for DC +12V fan Display ® Dimensions Œ Intel HD Graphic /GT1/GT2/GT3 with DX 11.1 , OGL 3.2, OCL 1.2 Œ 95mm (W) x 95mm (L) support Œ Single and dual channel 18/24 LVDS Environment Œ VGA interface (1920 x 1200) Œ Board level operating temperatures: -15°C to 60°C Œ DDI 1 with HDMI/DP/DVI support ( DDI2: optional) Œ Storage temperatures: -20°C to 80°C Œ Relative humidity: Audio 10% to 90% (operating, non-condensing) Œ HD audio interface 5% to 95% (non-operating, non-condensing) On-board LAN ® Certifications Œ Intel I218LM GbE controller, support boot from LAN, wake on LAN Œ Meet CE/FCC Class B Œ Support PXE boot from LAN, wake on LAN function COM Express COM Express connector C and D DDR3 CH A DDR3 CH B Display Port1 Display Port2 USB3.0 Boardwell MCP 40 x 24 mm (BGA1168) SATA3(4) LPC SPI HDA SDIO I2C SMB PCIEx4 COM Express connector A and B www.nexcom.com Block Diagram IMVP 12.6 CH7511B 2 CH LVDS eDPX2 CORE PWR eDP PORT:0-3 SATA BUS DDR3L 1600 MHz DDR3 Channel A DIMM0 LPC BUS SERIAL PORT:1.2 EC IT8528E/CX DDR3L 1600 MHz DDR3 Channel B DIMM1 SPI BUS SPI BIOS HDA BUS DISPLAY PORT B DISPLAY PORT C CH7517 VGA BUS PCI-E*1 BUS PORT:1,2,3,4,5,7 USB3.0 BUS PORT:0-3 PORT:8 PCIE*1 BUS TYPE 6 INTEL I218LM MDI BUS PCI-E*1 BUS PORT:6 GbE PHY TYPE 6 SMBUS PORT:0-7 USB2.0 BUS Ordering Information Œ ICES 671-4300U (P/N: TBD) ® COM Express Type 6 Compact module with 4th generation Intel Core™ i7/i5/i3 processor MCP/2C, 1.9GHz/DDR3L without ECC/PCIe/ HDMI/VGA/SATA/GBE Œ ICES 671-2980U (P/N: TBD) ® COM Express Type 6 Compact module with 4th generation Intel Core™ i7/i5/i3 processor MCP/2C, 1.6GHz/DDR3L without ECC/PCIe/ HDMI/VGA/SATA/GBE COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 03/05/2014 VCCIN USB2.0 PCIEx1(4)