Manufacturers
NEXCOM ICES 670
Description
COM Express Type 6, Basic Module with Mobile Intel® QM87 chipset 4th Generation Intel® Core™ Processors
The ICES 670 is a COM Express Type 6-pinouts Basic module featuring Intel® Lynx-Point PCH chipset supports Intel® 4th generation Intel® Core™ processors (Haswell/ Shark Bay mobile) with Dual ECC-DDR3 SO-DIMM socket up to 16GB DDR3L 1333/1600MHz SDRAM. The ICES 670 integrated Intel® GT1/ GT2/ GT3 graphics engines with DX11.1 support or expands via PCI Express Graphic 1x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows type 6-pinout Carrier board to implement HDMI, DVI, Display Port, eDP and legacy VGA, single channel 18-/ 24-bits LVDS interface. The high performance ICES 670 COM Express Basic Module supports 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and 7x PCIe x1 lanes through our NEXCOM designed ICES 8060 as well as customized solution for your embedded projects.
Part Number
ICES 670
Price
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Manufacturer
NEXCOM
Lead Time
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Category
Embedded Computers » Computer-on-Module
Specifications
CPU Support
Support Intel® BGA 1364, 4th generation Intel® Core™ processors (Haswell-M/ Shark Bay-MB)
Main Memory
Dual ECC-DDR3L/ SO-DIMMs, support 1333/1600MHz memory up to 16GB
Platform Control Hub
Intel® 8 series (Lynx Point-M) PCH chipset
BIOS
AMI System UEFI BIOS
Plug and play support
Advanced power management and advanced configuration & power interface support
Audio
HD audio interface
On-board LAN
Intel® Clarkville(I217) Gigabit Ethernet, support next generation vPro/iAMT
Support PXE boot from LAN, wake on LAN function
Signals down to I/O board
COM Express Connector
ABVGA/ LVDS/ 8x USB2.0 / HD Audio/ 4x SATA/ GbE/ GPIO/ LPC bus,1x PCIe x4/ 2x PCIe x1/ SMBus (I2C)/ SPI BIOS /SPK out
CDPCIex16/ 3x DDI /4x USB 3.0/ 1x PCIe x1
Power Requirements
+12V, +5VSB, +3.3V RTC power
Dimensions
95mm (W) x 125mm (L)
Environment
Board level operating temperatures: -15°C to 60°C
Storage temperatures: -20°C to 80°C
Relative humidity:10% to 90% (operating, non-condensing)5% to 95% (non-operating, non-condensing)
Certifications
Meet CE
FCC Class A
Categorization Information
IoT Automation Solutions
Embedded Computing
Computer-on-Module
Features
- Intel® 4th generation Core™ processor
- Mobile Intel® QM87 chipset
- Support PICMG COM.0 Rev. 2.1 Type 6 pin-outs
- Support Dual channel ECC-DDR3L/ SO-DIMMs 1333/1600MHz up to 16GB
- Support PCIe x16, 7x PCIe x 1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE
- Up to 3x independent displays, VGA, eDP/ LVDS, DVI, HDMI, DisplayPort
- Dimension 95 x 125mm2 (W x L)
Datasheet
Extracted Text
® COM Express Type 6, Basic Module with Mobile Intel QM87 chipset ® ICES 670 4th Generation Intel Core™ Processors Main F Main Features eatures ® Support PCIex16, 7 x PCIex1, 4 x USB3.0/8 x USB2.0, 2 x SATA3.0/2 Intel 4th generation Core™ processor ® x SATA2.0 and GbE Mobile Intel QM87 chipset Up to 3 x independent displays, VGA, eDP/LVDS, DVI, HDMI, Support PICMG COM.0 Rev. 2.1 Type 6 pin-outs DisplayPort Support Dual channel ECC-DDR3L/SO-DIMMs 1333/1600MHz up 2 Dimension 95 x 125mm (W x L) to 16GB Product Overview ® ® ® The ICES 670 is a COM Express Type 6-pinouts Basic module featuring Intel Lynx-Point PCH chipset supports Intel 4th generation Intel Core™ processors ® (Haswell/Shark Bay mobile) with Dual ECC-DDR3 SO-DIMM socket up to 16GB DDR3L 1333/1600MHz SDRAM. The ICES 670 integrated Intel GT1/GT2/ GT3 graphics engines with DX11.1 support or expands via PCI Express Graphic 1 x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows type 6-pinout Carrier board to implement HDMI, DVI, Display Port, eDP and legacy VGA, single channel 18-/24-bits LVDS interface. The high performance ICES 670 COM Express Basic Module supports 4 x USB3.0/8 x USB2.0, 2 x SATA3.0/ 2 x SATA2.0 and 7 x PCIex1 lanes through our NEXCOM designed ICES 8060 as well as customized solution for your embedded projects. Specifications CPU Support On-board LAN ® ® ® Support Intel BGA 1364, 4th generation Intel Core™ processors Intel Clarkville(I217) Gigabit Ethernet, support next generation vPro/ (Haswell-M/Shark Bay-MB) iAMT Support PXE boot from LAN, wake on LAN function Main Memory Signals down to I/O board Dual ECC-DDR3L/SO-DIMMs, support 1333/1600MHz memory up to 16GB COM Express Connector AB Platform Control Hub VGA/LVDS/8 x USB2.0/HD Audio/4 x SATA/GbE/GPIO/LPC bus, ® Intel 8 series (Lynx Point-M) PCH chipset 1 x PCIex4/2 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out BIOS CD AMI System UEFI BIOS PCIex16/3 x DDI/4 x USB3.0/1 x PCIex1 Plug and play support Power Requirements Advanced power management and advanced configuration & power +12V, +5VSB, +3.3V RTC power interface support Dimensions Display ® 95mm (W) x 125mm (L) Intel GT1/GT2/GT3 integrated graphics processing unit (iGPU) One PCI Express x16 (Gen. 3.0) Lane down to the carried board Environment Supports VGA and eDP/LVDS interface Board level operating temperatures: -15°C to 60°C 3 x DDI (Digital Display Interface) supports HDMI/DVI, DP/eDP Storage temperatures: -20°C to 80°C interfaces Relative humidity: Audio 10% to 90% (operating, non-condensing) HD audio interface 5% to 95% (non-operating, non-condensing) COM Express COM Express connector C and D COM Express connector A and B www.nexcom.com Block Diagram DDR3L 1600 MHz DDR3L 1600 MHz ECC DIMM0 ECC DIMM1 DDR3 CH A DDR3 CH B DISPLAY PORT D VCCIN DISPLAY PORT C IMVP 12.5 DISPLAY PORT B 31 x 24 mm (BGA1023) PCIex16 BUS 2 CH LVDS CH7511B eDPX2 FDI DMI Flexible Display DMI(X4) Interface (X2) FDI DMI VGA BUS HDA BUS PORT:0-3 SATA BUS LYNX Point QM87 SPI BUS USB3.0 BUS PORT:0-3 SPI BIOS 25 x 25 mm FCBGA(Mobile only) PORT:0-7 USB2.0 BUS PCIE*1 BUS PORT:8 LPC BUS PCIE BUS SMBUS SERIAL PORT:1.2 EC IT8518E/CX TYPE 6 TYPE 6 PCI-E*1 BUS PORT:1,2,3,4,5,7 INTEL I217LM MDI BUS PCI-E*1 BUS PORT:6 GbE PHY SMBUS Certifications Ordering Information Meet CE FCC Class A ICES 670 (P/N: 10K00067000X0) ® COM Express Type 6, Basic Module, onboard 4th Generation Intel ® Core™ Processors with ECC DDR3L/2 x SO-DIMMs, Mobile Intel QM87 Express Chipset COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 03/05/2014 Haswell-M LPC USB SPI SATA HDA VGA eDP CORE POWER DDR3 Channel A DDR3 Channel B PCIex16 Display Port PCIE BUS USB3.0
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