Manufacturers
NEXCOM ICES 668
Description
COM Express Type 6 Basic Module with Intel® QM77, Intel® 3rd Generation Core™ i7/ i5/ i3 Processors with ECC
The ICES 668 is a Type 6 pin-outs COM Express Basic module featuring Intel® QM77 PCH chipset supports Intel® 3rd generation Intel® Core™ processor with Dual DDR3 SO-DIMM socket up to 16GB DDR3 1333/ 1600MHz SDRAM with ECC support. The ICES 668 integrated Intel® HD graphics with DX11 support or expands via PCI Express Graphic 1x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows type 6 pin-out Carrier board to implement HDMI, DVI, Display Port, SDVO and legacy VGA, 18/24 bits LVDS interface. The high performance ICES 668 COM Express Basic Module supports 4x USB 3.0/ 8x USB 2.0, 2x SATA 3.0/ 2x SATA 2.0 and 7x PCIe x 1 lanes through our NEXCOM in-house designed ICEB 8060 evaluation carrier MB as well as customized solution for your embedded OEM/ ODM projects.
Part Number
ICES 668
Price
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Manufacturer
NEXCOM
Lead Time
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Category
Embedded Computers » Computer-on-Module
Specifications
CPU Support
Support Intel® BGA 1023, 3rd generation Intel® Core™ processor- Intel® Core™ i7 3615QE (4C/ 6M cache/ 2.3GHz/ Max. TDP 45W)- Intel® Core™ i7 3555LE (2C/ 4M cache/ 2.5GHz/ Max. TDP 25W)- Intel® Core™ i7 3517UE (2C/ 4M cache/ 1.7GHz/ Max. TDP 17W)- Intel® Core™ i3 3217UE (2C/ 3M cache/ 1.6GHz/ Max. TDP 17W)- Intel® Core™ i5 3610ME (2C/ 3M cache/ 2.7GHz/ Max. TDP 35W)
Main Memory
Dual DDR3/ SO-DIMMs, support 1333/1600MHz ECC system memory up to 16GB
Platform Control Hub
Intel® QM77 PCH chipset
BIOS
AMI System UEFI BIOS
Plug and play support
Advanced power management and advanced configuration & power interface support
Display
Intel® HD graphics with DX11 support up to triple independent displays
One PCI Express x16 Lane down to the carried board
Supports VGA and single/dual channel s 18/24 bit LVDS interface
3x DDI (Digital Display Interface) supports HDMI/ DVI, DisplayPort and SVDO interfaces
Audio
HD audio interface
On-board LAN
Intel® 82579LM Gigabit Ethernet, support iAMT 8.0
Support PXE boot from LAN, wake on LAN function
Signals down to I/O board
COM Express Connector
ABVGA/ LVDS/ 8x USB 2.0 / 2x Serial Port / HD Audio/ 4x SATA/ GbE/ GPIO/ LPC bus, 1x PCIe X4/ 2x PCIe X1/ SMBus (I2C)/ SPI BIOS /SPK out
CDPCIe x16/ 3x DDI/ 4x USB 3.0/ 1x PCIe x1
Power Requirements
+12V, +5VSB, +3.3V RTC power
Dimensions
95mm (W) x 125mm (L)
Environment
Board level operating temperatures: 0°C to 60°C
Storage temperatures: -20°C to 80°C
Relative humidity:10% to 90% (operating, non-condensing)5% to 95% (non-operating, non-condensing)
Certifications
Meet CE
FCC Class A
Categorization Information
IoT Automation Solutions
Embedded Computing
Computer-on-Module
Features
- Embedded Intel® 3rd generation Core™ i7/ i5/ i3 processor, Ivy Bridge Mbl + ECC
- Intel® QM77 PCH chipset support PICMG COM.0 Rev. 2.0 Type 6 pin-outs
- Support Dual channel DDR3 with ECC SO-DIMMs 1333/1600MHz up to 16GB
- Support PCIe x16, 7x PCIe x1, 4x USB3.0/ 8x USB 2.0, 2x SATA 3.0/ 2x SATA 2.0 and GbE
- Up to 3x Independent Displays, VGA, Dual Channels 18/24-bit LVDS, DVI, HDMI, DisplayPort
- Dimension 95mm (W) x 125mm (L)
Datasheet
Extracted Text
® COM Express Type 6 Basic Module with Intel QM77, ® ICES 668 Intel 3rd Generation Core™ i7/i5/i3 Processors with ECC Main F Main Features eatures ® Support PCIex16, 7 x PCIex1, 4 x USB3.0/8 x USB2.0, 2 x SATA 3.0/2 Embedded Intel 3rd generation Core™ i7/i5/i3 processor, x SATA 2.0 and GbE Ivy Bridge Mbl + ECC ® Up to 3 x Independent Displays, VGA, Dual Channels 18/24-bit Intel QM77 PCH chipset support PICMG COM.0 Rev. 2.0 LVDS, DVI, HDMI, DisplayPort Type 6 pin-outs Dimension 95mm (W) x 125mm (L) Support Dual channel DDR3 with ECC SO-DIMMs 1333/1600MHz up to 16GB Product Overview ® ® ® The ICES 668 is a Type 6 pin-outs COM Express Basic module featuring Intel QM77 PCH chipset supports Intel 3rd generation Intel Core™ processor ® with Dual DDR3 SO-DIMM socket up to 16GB DDR3 1333/1600MHz SDRAM with ECC support. The ICES 668 integrated Intel HD graphics with DX11 support or expands via PCI Express Graphic 1 x 16 lanes and support three DDI (Digital Display Interface) to follow the standard of PICMG COM.0 Rev. 2.0 specification. It allows type 6 pin-out Carrier board to implement HDMI, DVI, Display Port, SDVO and legacy VGA, 18/24 bits LVDS interface. The high performance ICES 668 COM Express Basic Module supports 4 x USB3.0/8 x USB2.0, 2 x SATA 3.0/2 x SATA 2.0 and 7 x PCIex1 lanes through our NEXCOM in-house designed ICEB 8060 evaluation carrier MB as well as customized solution for your embedded OEM/ODM projects. Specifications CPU Support Audio ® ® Support Intel BGA 1023, 3rd generation Intel Core™ processor HD audio interface ® - Intel Core™ i7 3615QE (4C/6M cache/2.3GHz/Max. TDP 45W) On-board LAN ® - Intel Core™ i7 3555LE (2C/4M cache/2.5GHz/Max. TDP 25W) ® Intel 82579LM Gigabit Ethernet, support iAMT 8.0 ® - Intel Core™ i7 3517UE (2C/4M cache/1.7GHz/Max. TDP 17W) ® Support PXE boot from LAN, wake on LAN function - Intel Core™ i3 3217UE (2C/3M cache/1.6GHz/Max. TDP 17W) ® Signals down to I/O board - Intel Core™ i5 3610ME (2C/3M cache/2.7GHz/Max. TDP 35W) COM Express Connector Main Memory AB Dual DDR3/SO-DIMMs, support 1333/1600MHz ECC system memory VGA/LVDS/8 x USB2.0/2 x Serial Port/HD Audio/4 x SATA/GbE/GPIO/ up to 16GB LPC bus, 1 x PCIex4/2 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out Platform Control Hub CD ® Intel QM77 PCH chipset PCIex16/3 x DDI/4 x USB3.0/1 x PCIex1 BIOS Power Requirements AMI System UEFI BIOS +12V, +5VSB, +3.3V RTC power Plug and play support Dimensions Advanced power management and advanced configuration & power 95mm (W) x 125mm (L) interface support Environment Display ® Board level operating temperatures: 0°C to 60°C Intel HD graphics with DX11 support up to triple independent displays Storage temperatures: -20°C to 80°C One PCI Express x16 Lane down to the carried board Relative humidity: Supports VGA and single/dual channel s 18/24 bit LVDS interface 10% to 90% (operating, non-condensing) 3 x DDI (Digital Display Interface) supports HDMI/DVI, DisplayPort and 5% to 95% (non-operating, non-condensing) SVDO interfaces COM Express COM Express connector C and D COM Express connector A and B www.nexcom.com Block Diagram DDR3 Channel A DDR3 CH A DDR3 1066/1333 MHz ECC DIMM0 Ivy Bridge DDR3 Channel B DDR3 1066/1333 MHz ECC DIMM1 Vcore IMVP 7 31 x 24 mm (BGA1023) GFXCORE PCIex16 BUS FDI DMI Flexible DMI(X4) Display Interface VGA BUS FDI DMI DISPLAY PORT D Panther Point HDA BUS DISPLAY PORT C PORT:0-3 SATA BUS DISPLAY PORT B QM77 PORT:A.B LVDS BUS USB3.0 BUS PORT:0-3 25 x 25 mm PORT:0-7 USB2.0 BUS FCBGA(Mobile only) PCIE*1 BUS PORT:7 LPC BUS PCIE BUS SMBUS SPI LPC TO COM SERIAL PORT:1.2 F81216 PCI-E*1 BUS PORT:1,2,3,4,5,6 BIOS TYPE 6 HWM INTEL WG82579LM iAMT NCT7802Y TYPE 6 MDI BUS PCI-E*1 BUS PORT:8 GbE PHY SPI ROM SMBUS SPI BUS Certifications Ordering Information Meet CE FCC Class A ICES 668-3610ME (P/N: 10K00066806X0) COM Express Type 6, Basic Module, QM77 onboard 3rd Generation ® Intel Core™ i5-3610ME (2 x 2.7GHz, 3MB Cache, 35W) processor, ECC DDR3/2 x SO-DIMMs ICES 668-3615QE (P/N: 10K00066805X0) COM Express Type 6, Basic Module, QM77 onboard 3rd Generation ® Intel Core™ i7-3615QE (4 x 2.3GHz, 6MB Cache, 45W) processor, ECC DDR3/2 x SO-DIMMs ICES 668-3555LE (P/N: 10K00066804X0) COM Express Type 6, Basic Module, QM77 onboard 3rd Generation ® Intel Core™ i7-3555LE (2 x 2.5GHz, 4MB Cache, 25W) processor, ECC DDR3/2 x SO-DIMMs ICES 668-3517UE (P/N: 10K00066803X0) COM Express Type 6, Basic Module, QM77 onboard 3rd Generation ® Intel Core™ i7-3517UE (2 x 1.7GHz, 4MB Cache, 17W) processor, ECC DDR3/2 x SO-DIMMs ICES 668-3217UE (P/N: 10K00066801X0) COM Express Type 6, Basic Module, QM77 onboard 3rd Generation ® Intel Core™ i3-3217UE (2 x 1.6GHz, 3MB Cache, 17W) processor, ECC DDR3/2 x SO-DIMMs ICES 668 F- kit (P/N: 10K00066807X0) Active Fan Kits with heat- spreader, heat-sink and cooling fan for ICES 668 series ICEB 8060 (P/N: 10KB0806000X0) RoHS Compliant COM Express Type 6, COM.0 Rev. 2.0 Evaluation CRB, 3 x DDI/VGA/ LVDS/4 x USB3.0/8 x USB2.0/6 x COM/2 xGbE/5.1 HD, SPDIF/2 x SATA3.0/mSATA/CFast/PCIex16/PCIex4/PCIex1/mPCIe, ATX power input COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 03/05/2014 VGA LPC USB (12) LVDS SATA HDA CORE POWER DISPLAY DISPLAY DISPLAY PCIE BUS USB3.0 PCIex16 DDR3 CH B PORT B PORT C PORT D
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