Manufacturers
NEXCOM ICES 667
Description
COM Express™ Type 6, Basic Module With QM77 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family
The ICES 667 is a Type 6 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset supports 3rd generation Intel® Core™ i7/ i5/ i3 rPGA988 embedded processors up to i7-3610QE (4x 2.3Ghz/ max.TDP 45W) with two DDR3 SO-DIMMs 1333/ 1600MHz non-ECC up to 16GB.
Part Number
ICES 667
Price
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Manufacturer
NEXCOM
Lead Time
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Category
Embedded Computers » Computer-on-Module
Specifications
CPU Support
Support 3rd generation Intel® Core™ i7/ i5/ i3 embedded rPGA988 processors– Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)– Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)– Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)
Main Memory
Two DDR3 SO-DIMMs, 1333/ 1600 MHz SDRAM non-ECC up to 16GB
Platform Control Hub
Intel® QM77 PCH (option HM76) chipset
BIOS
AMI UEFI System BIOS
Plug and play support
Advanced Power Management and ACPI support
Display
Intel® HD graphics with DX11 support and supports Triple independent displays displays
One PCI Express x 16 Lane (Gen. 3.0) down to the carried board
Supports VGA, single/ dual channels LVDS 18/ 24-bit interfaces
3x DDI supports HDMI, DVI, DisplayPort and SDVO (only by Port B/ DDI #1)
Audio
HD audio interface
On-board LAN
Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported with QM77 only)
Support boot from LAN, wake on LAN function
Signals down to I/O board
COM Express Connector
ABVGA/ LVDS/ 8x USB 2.0, HD Audio/ 4x SATA2.0/ 3.0, GbE/ GPIO/ LPC bus, 1x PCIe x4/ 2x PCIe x1/ SMBus (I2C)/ SPI BIOS /SPK out
CDPCIe x16(Gen. 3.0)/ 3x DDI/ 4x USB 3.0/ PCIe x1
Power Requirements
+12V, +5VSB, +3.3V RTC power
Dimensions
95mm (W) x 125mm (L)
Environment
Board level operating temperature: -15°C to 60°C
Storage temperature: -20°C to 80°C
Relative humidity:10% to 90% (operating, non-condensing)5% to 95% (non-operating, non-condensing)
Certifications
Meet CE
FCC Class A
Categorization Information
IoT Automation Solutions
Embedded Computing
Computer-on-Module
Features
- 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
- Intel® QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 Type 6 pin-outs
- Support two DDR3 SO-DIMMs 1333/ 1600 non-ECC up to 16GB
- Support PCIex16 (Gen3.0) 7x PCIEx1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE
- Up to 3x DDI (DP/ HDMI/ DVI) multiple displays, VGA, dual channels 18/ 24-bit LVDS
- Dimension: 95mm (W) x 125mm (L)
Datasheet
Extracted Text
COM Express™ Type 6, Basic Module With QM77 ® ICES 667 3rd Generation Intel Core™ rPGA988 Embedded Processors Family Main F Main Features eatures ® Support PCIex16 (Gen3.0) 7 x PCIEx1, 4 x USB3.0/8 x USB2.0, 3rd generation Intel Embedded Core™ rPGA988 embedded 2 x SATA3.0/2 x SATA2.0 and GbE processors family ® Up to 3 x DDI (DP/HDMI/DVI) multiple displays, VGA, dual channels Intel QM77 PCH (HM76 ) chipset support PICMG COM.0 Rev. 2.0 18/24-bit LVDS Type 6 pin-outs Dimension: 95mm (W) x 125mm (L) Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB Product Overview ® ® The ICES 667 is a Type 6 COM Express Basic Module featuring Intel QM77 PCH (option HM76) chipset supports 3rd generation Intel Core™ i7/i5/i3 rPGA988 embedded processors up to i7-3610QE (4 x 2.3GHz/max.TDP 45W) with two DDR3 SO-DIMMs 1333/1600MHz non-ECC up to 16GB. ® ® The 3rd Generation Intel Core™ i7/i5/i3 processors integrated with Intel HD graphics with DX11 support one PCIex16 (Gen. 3.0) to carrier board. The Three DDI interfaces allows ICES 667 implement HDMI, DVI, Display Port, SDVO on Customer Solution Board besides VGA, LVDS interface. The high performance ICES 667 COM Express Module supports 4 x SATA2.0/3.0, 12 x USB2.0/3.0 and 7 x PCIex1 lanes through the carrier board; NEXCOM is offering standard Type 6 carrier board, ICEB 8060 to help device makers and equipment builders to evaluate full set of I/O function and add-on cards at early development stage. Specifications CPU Support On-board LAN ® ® Support 3rd generation Intel Core™ i7/i5/i3 embedded rPGA988 Intel 82579LM Gigabit Ethernet, support iAMT 8.0 (supported with processors QM77 only) ® - Intel Core™ i7-3610QE (4 x 2.3GHz/6MB cache/Max. TDP 45W) Support boot from LAN, wake on LAN function ® - Intel Core™ i7-3610ME (2 x 2.7GHz/3MB cache/Max. TDP 35W) Signals down to I/O board ® ® - Intel Celeron B810 (2 x 1.6GHz/2MB cache/Max. TDP 35W) COM Express Connector Main Memory AB Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB VGA/LVDS/8 x USB2.0, HD Audio/4 x SATA2.0/3.0, GbE/GPIO/LPC bus, 1 x PCIex4/2 x PCIex1/SMBus (I2C)/SPI BIOS/SPK out Platform Control Hub CD ® Intel QM77 PCH (option HM76) chipset PCIex16(Gen. 3.0)/3 x DDI/4 x USB3.0/PCIex1 BIOS Power Requirements AMI UEFI System BIOS +12V, +5VSB, +3.3V RTC power Plug and play support Advanced Power Management and ACPI support Dimensions 95mm (W) x 125mm (L) Display ® Intel HD graphics with DX11 support and supports Triple Environment independent displays displays Board level operating temperature: -15°C to 60°C One PCI Express x16 Lane (Gen. 3.0) down to the carried board Storage temperature: -20°C to 80°C Supports VGA, single/dual channels LVDS 18/24-bit interfaces Relative humidity: 3 x DDI supports HDMI, DVI, DisplayPort and SDVO 10% to 90% (operating, non-condensing) (only by Port B/DDI #1) 5% to 95% (non-operating, non-condensing) Audio Certifications HD audio interface Meet CE COM Express COM Express connector C and D COM Express connector A and B www.nexcom.com Block Diagram DDR3 Channel A DDR3 CH A DDR3 1600 MHz NON-ECC Ivy Bridge DDR3 Channel B DDR3 1600 MHz NON-ECC Vcore IMVP 7 GFXCORE 37.5 x 37.5 mm rPGA Socket(rPGA988B) PCIex16 BUS FDI DMI Flexible DMI(X4) Display Interface VGA BUS FDI DMI DISPLAY PORT D HDA BUS DISPLAY PORT C Panther Point PORT:0-3 SATA BUS DISPLAY PORT B PORT:A.B LVDS BUS USB3.0 BUS PORT:0-3 QM77/HM76 PORT:0-7 USB2.0 BUS 25 x 25 mm FCBGA(Mobile only) PCIE*1 BUS PORT:7 LPC BUS PCIE BUS SMBUS SPI PCI-E*1 BUS PORT:1,2,3,4,5,6 BIOS HWM INTEL WG82579LM iAMT NCT7802Y MDI BUS PCI-E*1 BUS PORT:8 TYPE 6 GbE PHY SPI ROM TYPE 6 SMBUS SPI BUS FCC Class A Ordering Information ICES 667 (P/N: 10K00066700X0) COM Express type 6, basic Module QM77 support 3rd Generation ® Intel Core™ rPGA988 embedded processors, non-ECC DDR3/2 x SO- DIMMs ICES 667F-kit (P/N: 10K00066702X0) COM Active fan kits with heat-spreader, heat-sink and cooling fan for ICES 667 ICEB 8060 (P/N: 10KB086000X0) COM Express type 6, COM.0 Rev. 2.0 Evaluation Carrier Board, 3 x DDI/ VGA/LVDS/4 x USB3.0/8 x USB2.0/6 x COM/2 x GbE/5.1HD, SPDIF/2 x SATA3.0/mSATA/CFast/PCIex16/PCIex4/2 x PCIex1/mPCIe, ATX power input COM Express We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 03/05/2014 VGA LPC USB (14) LVDS SATA HDA CORE POWER DISPLAY DISPLAY DISPLAY PCIE BUS USB3.0 PCIex16 DDR3 CH B PORT B PORT C PORT D
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