NEXCOM ACES 3354

Description
SMARC, TI Sitara AM3354, ARM® Cortex™ A8, 512MB DDR3, 4GB eMMC, 24-bit LVDS/ TTL, GbE, USB, USB-OTG, UART, GPIO
NEXCOM ACES 3354 is based on TI Sitara™ AM3354 ARM® Cortex™ A8 technology. ACES 3354 is designed as building blocks for tiny, small portable and stationary embedded systems. It support DRAM onboard, boot flash, power sequencing management, CPU power supplies, gigabit Ethernet and a single channel LVDS display transmitter are connected onto 314pins edge card as bus interfaces.
Part Number
ACES 3354
Price
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Manufacturer
NEXCOM
Lead Time
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Category
Embedded Computers » sARM/SoC Solutions
Specifications
Form factor
SMARC STD 1.0 compliance with MXM3.0/314pins, 82 x 50mm
Processor
Build-in Texas Instruments AM3354 ZCZ 324-pin PBGA Cortex™ A8 up to 720MHz
Power Management IC
PMIC TPS65910A3 integrated w/ 4 DC/DCs, 8 LDOs and RTC in 6x6mm QFN
System Memory
SDRAM: DDR3 512MB
Flash: eMMC 4GB
SPI Flash: 8Mbit
Multimedia
Graphic Accelerator: SGX530
Display Interfaces:- LVDS: Default 800 x 480 (24bit) for 7" LCD/ LVDS- TTL: Reserved design interface for resolution up to 1024x 768@60Hz
Audio: I2S
Connectivity
Network: 1x EMAC 10/100/1000 RGMII Ethernet interface
USB#0: Added onboard USB Hub GENESYS: GL850G for 2x USB 2.0 Host
USB#1: USB-OTG
SDIO: up to 2x MMC/ SD
UART: (TX, RX, CTS#, RTS#) 1x for Debug
SPI: One Serial Peripheral Interface (SPI) interfaces
I2C: two Inter-Integrated circuit interfaces
General Purpose I/O: 8x GPIO signals
DCAN: Dual CAN interfaces support bitrates up to 1 Mbit/s CAN 2.0B protocol.- Logic level signals from Module based CAN bus protocol controllers- RXD, TXD only- Two module GPIOs reserved for optional use as CAN bus error status
Watchdog timer interface
Boot Source Select
Module SPI flash
Module eMMC flash
Carrier SD card
System Environment
Power Input: 5VDC ±5% (supply by ULP-COM/ MXM3.0 interface)
Power Consumption: DC + 5V/ 0.4A typical 2W to 6W during active operation
Dimensions: 82 x 50mm
Environment- Module operating temperatures: 0°C to 60°C- Storage temperature: -20°C to 85°C- Relative humidity: 10% to 90%, (Non-condensing)
Certifications: Meet CE/ FCC class A
Categorization Information
IoT Automation Solutions
Embedded Computing
ARM/SoC Solution
Features
- TI-AM3354, ARM® Cortex® A8 up to 720MHz
- Graphic accelerator SGX530
- Onboard 512MB DDR3, 4GB eMMC
- Single channel LVDS/ TTL 24-bit Display interface
- Gigabit Ethernet, USB, USB-OTG, SDIO, 2UART, SPI, DCAN, I2S, 3x I2C and 8x GPIO
- SMARC STD 1.0 compliance with MXM3.0/314pins, 82 x 50mm
Datasheet
Extracted Text
® SMARC, TI Sitara AM3354, ARM Cortex™ A8, 512MB DDR3, 4GB eMMC, ACES 3354 24-bit LVDS/ TTL, GbE, USB, USB-OTG, UART, GPIO Main Features ® ® Gigabit Ethernet, USB, USB-OTG, SDIO, 2UART, SPI, DCAN, I2S, TI-AM3354, ARM Cortex A8 up to 720MHz 3x I2C and 8x GPIO Graphic accelerator SGX530 SMARC STD 1.0 compliance with MXM3.0/314pins, 82 x 50mm Onboard 512MB DDR3, 4GB eMMC Single channel LVDS/ TTL 24-bit Display interface Product Overview ™ ® NEXCOM ACES 3354 is based on TI Sitara AM3354 ARM Cortex™ A8 technology. ACES 3354 is designed as building blocks for tiny, small portable and stationary embedded systems. It support DRAM onboard, boot flash, power sequencing management, CPU power supplies, gigabit Ethernet and a single channel LVDS display transmitter are connected onto 314pins edge card as bus interfaces. The ACES 3354 features include parallel LCD display interfaces, serial and parallel input; multiple I2C, I2S and serial port options; USB client/ host mode (OTG) operation; eMMC and SD card operation. ACES 3354 help device makers or product builder together with NEXCOM in house design carrier board ACEB 35 as completed evaluation platform. ® NEXCOM provide ARM based developer starter-kit by ACEK 3354-7P, build-in 7” LVDS LCD and capacitive touch panel with application BSP-ready for Win CE 7.0. ACES 3354 module features lower power that enables fanless solution system designs, drives to smaller size equipment, and tough enclosures for shock ® protection. It is the ideal ARM based solution human machine interfaces platform for industrial automation, industrial control, remote monitoring devices. Specifications Form factor Multimedia SMARC STD 1.0 compliance with MXM3.0/314pins, 82 x 50mm Graphic Accelerator : SGX530 Display Interfaces : Processor - LVDS : Default 800 x 480 (24bit) for 7" LCD/ LVDS Build-in Texas Instruments AM3354 ZCZ 324-pin PBGA Cortex™ A8 up - TTL : Reserved design interface for resolution up to 1024x 768@60Hz to 720MHz Audio: I2S Power Management IC Connectivity PMIC TPS65910A3 integrated w/ 4 DC/DCs, 8 LDOs and RTC in Network : 1x EMAC 10/100/1000 RGMII Ethernet interface 6x6mm QFN USB#0 : Added onboard USB Hub GENESYS: GL850G for 2x USB 2.0 System Memory Host SDRAM : DDR3 512MB USB#1 : USB-OTG Flash : eMMC 4GB SDIO : up to 2x MMC/ SD SPI Flash : 8Mbit UART : (TX, RX, CTS#, RTS#) 1x for Debug Embedded ARM www.nexcom.com Dimension Drawing Block diagram of ACEB 35/ ULP-COM Carrier Board (146 x 105mm) Block diagram of ACES 3354/ ULP-COM module (82 x 50mm) DDR3 303MHz 24 bits TTL RGB CH7026 512MB/1GB LINE-OUT I2C0 I2S RGMII2 MDI MDI 3PIN JSTx2 AIC3106 RJ-45 DB-15 Giga LAN MIC-IN PMIC PWR 24bit TTL LVDS TTL -> LVDS SDIO0(4bits) LVDS 18 bit LVDS SD Socket SPI SPI0(CS0) CONNECTOR 8MbFLASH 24 bits TTL HUBUSB1 24 bits TTL SPI0 (CS1) 24 bits TTL USB1 TOUCH USB HUB HUBUSB2 CONNECTOR CONTROL AM335X ULP-COM USB0 (For OTG) 324 Pin 314 Pin GPIOx10 ULP-COM USB I2C x 3 HUBUSB1 PIN HEADER 314 Pin CONNECTOR I2S(For Audio) SDIO ( 4 bits ) HUBUSB2 MINIPCIE DCANx2 SPI0 (CS1) 3PIN JSTx2 CONNECTOR GPIO x 8 CAN BUS x2 MINIUSB UART5 USB0 UART5(TX,RX,CTS,RTS) DB-9 CONNECTOR UART0 ( For Debug) 4Pin JSTx1 SDIO1 I2C UART4 6Pin JSTx1 JST 3Pin (For Touch) eMMC 4GB SPI : One Serial Peripheral Interface (SPI) interfaces Ordering Information I2C : two Inter-Integrated circuit interfaces General Purpose I/O : 8x GPIO signals ACES 3354 (P/N : SMARC module are subject to request) DCAN : Dual CAN interfaces support bitrates up to 1 Mbit/s CAN 2.0B SMARC module, AM3354 Cortex™ A8 720MHz, 512MB DDR3, protocol. 4GB eMMC, GbE, USB, USB-OTG - Logic level signals from Module based CAN bus protocol controllers - RXD, TXD only - Two module GPIOs reserved for optional use as CAN bus error status Watchdog timer interface Boot Source Select Module SPI flash Module eMMC flash Carrier SD card System Environment Power Input : 5VDC ±5% ( supply by ULP-COM/ MXM3.0 interface) Power Consumption : DC + 5V/ 0.4A typical 2W to 6W during active operation Dimensions : 82 x 50mm Environment - Module operating temperatures : 0°C to 60°C - Storage temperature : -20°C to 85°C - Relative humidity : 10% to 90%, (Non-condensing) Certifications : Meet CE/ FCC class A Embedded ARM We reserve the right to change specifications and product descriptions at any time without prior notice. Last update: 02/26/2014
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