AXIOMTEK CEM860DG-B810E (P/N- E380860104)

Description
Intel® Core™ i7/i5/i3 COM Express™ Type 6 Module with Intel® QM67
The CEM860 Type 6 COM Express module is equipped with the new Mobile Intel® QM67 PCH and supports 2nd Generation Intel® Core™ i7, i5 and i3 quad and dual core processors and Intel® Celeron® processors. The compact CEM860 offers up to 16 GB of DDR3 memory in two SO-DIMM slots, four SATA ports, eight USB 2.0 ports, two USB 3.0 ports (optional), six PCI Express x1 ports, and a PCI Express x16 interface. Integrated with HD Graphics 3000 core, the COM Express module offers outstanding graphics performance and multiple-display capability. It features type 6 pin-outs, which provides more flexibility in digital display configurations through three DDIs (digital display interfaces). The CEM860 is ideal for graphics-intensive and I/O rich applications such as telecommunication, medical imaging, digital signage, gaming machines, military, and networking. COM Express type 6 module with Intel® Celeron® B810E 1.6 GHz, VGA/LVDS, 10/100/1000Mbps Ethernet, TPM (recommended cooler P/N-E39J000102)
Part Number
CEM860DG-B810E (P/N- E380860104)
Price
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Manufacturer
AXIOMTEK
Lead Time
Request Quote
Category
Boards & Modules » System on Module
Specifications
CPU
2nd generation Intel® Quad/ Dual Core™ i7/i5/i3 & Celeron® processor
Chipset
Intel® QM67
System Memory
2 x 204-pin SO-DIMM DDR3-1066/1333 up to 16 GB
BIOS
AMI
USB
8 x USB 2.02 x USB 3.0 (optional)
Ethernet
1 x 10/100/1000Mbps (Intel® 82579LM)
Display
1 x VGA1 x LVDS3 x DDI (SDVO, DP, HDMI, DVI)
Digital I/O
4-IN & 4-OUT
Audio
HD link interface to baseboard for external Codec
Storage
2 x SATA-6002 x SATA-300
Expansion
1 x PCIe x16 6 x PCIe lanes support for 6 x PCIe x1 or 1 x PCIe x4 + 2 x PCIe x1 devices
Others
1 x LPC interface1 x SPI interface
Power Input
Differentiate by onboard processor
Watchdog Timer
255 levels, 1~255 sec.
Operating Temperature
0°C ~ +60°C (32°F ~ 140°F)
Relative Humidity
10% ~ 95% relative humidity, non-condensing
Dimensions
125 x 95 mm
Board Thickness
1.6 mm
Certification
CE
Categorization Information
Boards & Modules
System on Module
COM Express Type 6
Features
- 2nd generation Intel® Core™ processor
- Intel® QM67 chipset
- 2 DDR3-1066/1333 SO-DIMMs max. up to 16 GB
- 22 lanes of PCIe Gen 2 at 5GT/s
- 2 SATA-600 & 2 SATA-300
- 8 USB 2.0 ports
- 2 USB 3.0 ports (optional)
- TPM 1.2 supported (optional)
Datasheet
Extracted Text
COM Express Type 6 Module CEM860 COM Express Type 6 Module with Intel® Core™ i7/i5/i3 and Intel® QM67 Features ● 2nd gen Intel® Core™ processor ● Intel® QM67 chipset ● 2 DDR3-1066/1333 SO-DIMM, up to 16GB Double deck ● 22 lanes of PCIe Gen 2 at 5GT/s DDR3 SO-DIMM ● 2 SATA-600 & 2 SATA-300 ● 8 USB 2.0 ● 2 USB 3.0 (optional) ● TPM 1.2 supported (optional) 0 DDR3 DDR3 1 USB USB Full Solid Low Power DDR3 USB 3.0 DualView Cap Design Core System 2 CPU 2nd generation Intel® Quad/ Dual Core™ i7/i5/i3 & Celeron® processor Rear view System Memory 2 x 204-pin SO-DIMM DDR3-1066/1333, up to 16GB 3 Chipset Intel® QM67 Packing List BIOS AMI UEFI BIOS SSD N/A Quick installation guide, user's manual/utility CD Watchdog Timer 255 levels, 1~255 sec. 4 Expansion Interface 1 x PCIe x16 graphics port 6 x PCIe lanes support for 6 x PCIe x1 or Ordering Information 1 x PCIe x4 + 2 x PCIe x1 devices Standard Battery N/A 5 CEM860DG-i5-2515E COM Express Type 6 module with Intel® Core™ i5-2515E Power Requirements Differentiate by onboard processor (P/N: E380860101) 3.1 GHz, VGA/LVDS, GbE LAN, USB 3.0 and TPM Size 125 x 95 mm (recommended cooler P/N: E39J000101) Board Thickness 1.6 mm CEM860DG-i3-2340UE COM Express Type 6 module with Intel® Core™ i3-2340UE Temperature 0°C ~ +60°C (32°F ~ 140°F), operation 6 (P/N: E380860103) 1.3 GHz, VGA/LVDS, GbE LAN, USB 3.0 and TPM Operation Humidity 10% ~ 95% relative humidity, non-condensing (recommended cooler P/N: E39J000101) CEM860DG-B810E COM Express Type 6 module with Intel® Celeron® B810E (P/N: E380860104) 1.6 GHz, VGA/LVDS, GbE LAN, TPM (recommended cooler P/N: E39J000102) 7 I/O CEM860DG-i7-2715QE COM Express Type 6 module with Intel® Core™ i7-2715QE MIO 1 x LPC interface (P/N: E380860100) 3 GHz, VGA/LVDS, GbE LAN, USB 3.0 and TPM 1 x SPI interface (recommended cooler P/N: E39J000100) SATA 2 x SATA-600, 2 x SATA-300 CEM860DG-i7-2610UE COM Express Type 6 module with Intel® Core™ i7-2610UE Hardware Monitoring N/A (P/N: E380860102) 2.4 GHz, VGA/LVDS, GbE LAN and TPM (recommended cooler P/N: E39J000100) Ethernet 1 port as 10/100/1000 Mbps supports Wake-on-LAN, RPL/PXE Boot ROM with Intel® 82579LM CEM860DG-i7-2610UE WT COM Express Type 6 module with Intel® i7-2610UE 2.4 GHz, VGA/LVDS, GbE LAN, TPM and W.T. (-40° ~ +80°C) Audio HD link interface to baseboard for external Codec (recommended cooler P/N: E39J000100) USB 8 x USB 2.0 2 x USB 3.0 (optional) Cooler with heatspreader TPM 1.2 Infineon SLB9635 for trusted platform (optional) CEB94006 ATX form factor Type 6 baseboard SMBus Yes E39J000100 TS000-CEM860-i7 with fan RC (up to 45 W Core™ i CPU) Digital I/O 4 channels IN & 4 channels OUT E39J000101 TS000-CEM860-i5/i3 with fan RC (up to 35 W Core™ i CPU) E39J000102 TS000-CEM860-celeron with fan RC (up to 35 W Core™ i CPU) Display * W.T.: Wide Temperature Chipset Intel® HD graphics 3000 code Memory Size Depending on integrnted GPU Display Interface 1 x VGA 1 x LVDS; 18/24-bit single/dual channel 3 x DDI (SDVO, DP, HDMI, DVI) axiomtek.com 84 * All specifications and photos are subject to change without notice. © 2017 Axiomtek Co., Ltd. All rights reserved.
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