AAEON COM-QM77 REV.B

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Details

Part Number COM-QM77 REV.B
Manufacturer AAEON
Category Uncategorized
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Our Process

Our Process: Preparation
Preparation

Once you accept your quote and confirm your order, we prepare by retrieving related parts and components from our inventory. Anything we do not currently have in stock is sourced.

Our Process: Receiving
Receiving

Upon receipt, all parts are visually inspected for damage and then photographed to document their condition. Parts acquired from vendors must meet our quality standards.

Our Process: Initial Testing
Initial Testing

Industrial computer boards and other parts we are equipped to evaluate are tested to verify functionality and discover possible damage.

Our Process: Refurbishment
Refurbishment

Industrial computer boards have all components with low MTBF numbers (such as capacitors and connectors) replaced and are washed in our PCB cleaner to remove dust and grime.

Our Process: Repair
Repair

Industrial computer boards are fully diagnosed and repaired by our engineers. Logs of the problems encountered and solutions implemented are recorded.

Our Process: Final Testing
Final Testing

Industrial computer boards have all I/O connections rigorously tested to ensure that everything is working properly before the board is certified as ready to ship.

Our Process: Shipping
Shipping

After photos are taken to document the exterior condition of the part, it is packaged and sent to the customer. ESD-safe materials are used to protect sensitive equipment on its journey.

Who We Are

IPC Station is a website of GID Industrial, an ISO 9001:2015-certified company that has specialized in servicing industrial computer boards and providing other industrial products for sectors including manufacturing, defense, aerospace, entertainment, healthcare, and more by utilizing our combined skills and vast international network of trusted suppliers since our founding in 2015.

Do you need a COM-QM77 REV.B? We can help you find it at a competitive price!

Specifications

CPU Onboard 3rd Generation Intel® Core™ i7/i5/i3/Celeron® Processor (3rd Generation, FCBGA1023)
Chipset 2nd Generation Intel® QM77
Memory 204-pin DDR3 SODIMM x 2, Max. 16GB (DDR3 1333/1600),support dual-channel function
Video DVI x 2
HDMI x 2
DisplayPort™ x 2
Up to 24-bit dual-channel LVDS
LAN Intel® 82579LM, 10/100/1000Base-TX
I/O Ports UART x 2 (TX/RX only)
USB2.0 x 8
USB 3.0 x 4
Up to 4 in and 4 out
Storage Interface SATA 3.0Gb/s x 2
SATA 6.0Gb/s x 2
Audio High definition audio
Expansion Interface PCI-Express [x16] x 1
PCI-Express [x1] x 7
LPC bus x 1
SMBus x 1
UART x 2 (TX/RX only)
Power Requirement +12V only
2-pin wafer for RTC battery
Operating Temperature 32°F ~ 140°F (0°C ~ 60°C)
Other Info MTBF (Hours): 83,000

Features

  • Onboard 3rd Generation Intel® Core™ i7/ i5/ i3/ Celeron®
  • Processor (FCBGA1023)
  • 2nd Generation Intel® QM77 PCH
  • Dual-channel SODIMM DDR3 1333/1600 Memory
  • Max. 16 GB
  • Gigabit Ethernet (iAMT 8.0 Support)
  • CRT
  • Up to 24-bit Dual-channel LVDS LCD
  • DisplayPort™
  • SATA 6.0Gb/s x 2 + SATA 3.0Gb/s x 2
  • USB3.0 x 4
  • USB2.0 x 8
  • PCI-Express [x16] x 1
  • PCI-Express [x1] x 7
  • COM Express Basic Module
  • Pin-out Type 6
  • COM.0 Rev. 2.0

Datasheet

Download "COM-QM77RevB.pdf" (286 KiB)

Extracted Text

COM Express CPU Modules COM-QM77 Rev.B 05 COM Express Type 6 CPU Module with Onboard Intel® Core™ i7/i5/i3/Celeron® Processor (3rd Generation) Features ■■ 2nd/3rd Generation Onboard Intel® Core™ i7/ i3/ Onboard 3rd Generation Intel® Core™ i7/ i5/ i3/ Celeron® Celeron® Processor Processor (FCBGA1023) DDR3 SODIMM ■■ 2nd Generation Intel® QM77 PCH ■■ Dual-channel SODIMM DDR3 1333/1600 Memory, Max. 16 GB ■■ Gigabit Ethernet (iAMT 8.0 Support) ■■ CRT, Up to 24-bit Dual-channel LVDS LCD, DisplayPort™ ■■ SATA 6.0Gb/s x 2 + SATA 3.0Gb/s x 2 ■■ USB3.0 x 4, USB2.0 x 8 ■■ PCI-Express [x16] x 1, PCI-Express [x1] x 7 ■■ COM Express Basic Module, Pin-out Type 6, COM.0 Rev. 2.0 Intel® QM77 PCH Intel® 82579LM Gigabit Ethernet Specifications System I/O Form Factor COM Express Basic module, Pin-out Type 6, COM. 0 Rev. 2.0 SATA 3.0Gb/s x 2 Onboard 3rd Generation Intel® Core™ i7/i5/i3/Celeron® Processor (3rd Storage Processor SATA 6.0Gb/s x 2 Generation, FCBGA1023) Serial Port UART x 2 (TX/RX only) 204-pin DDR3 SODIMM x 2, Max. 16GB (DDR3 1333/1600),support dual-channel System Memory Parallel Port — function USB2.0 x 8 Chipset 2nd Generation Intel® QM77 USB USB 3.0 x 4 I/O Chipset 2nd Generation Intel® QM77 PS/2 Port — Ethernet Intel® 82579LM, 10/100/1000Base-TX IrDA — TPM v1.2 (optional) Audio High definition audio AMI BIOS BIOS GPIO Up to 4 in and 4 out SPI type, 16MB ROM EEPROM Atmel® AT24C02, save BIOS and configuration data (Optional) Wake On Lan Yes Watchdog Timer ITE8518E-L, 255 levels Packing List H/W status Monitoring Supports CPU Temperature Monitoring • M2.5 Screw x 5 PCI-Express [x16] x 1 PCI-Express [x1] x 7 • Product CD Expansion interface LPC bus x 1 • COM-QM77 Rev.B SMBus x 1 UART x 2 (TX/RX only) +12V only Power Requirement 2-pin wafer for RTC battery Intel® i3-3217UE 1.6GHz, DDR3 4GB Power Consumption 2.23A@+12V (w/ ECB-917T) Board Size 4.92" (L) x 3.74"(W) (125mm x 95mm) Gross Weight 0.66lb (0.3kg) Operating Temperature 32°F ~ 140°F (0°C ~ 60°C) Storage Temperature -40°F ~ 176°F (-40°C ~ 80°C) Operating Humidity 0% ~ 90% relative humidity, non-condensing MTBF (Hours) 83,000 Display Supports HDMI /DP, CRT or HDMI/ DP/ DVI simultaneous/ three view displays Intel® Core™ i7/i5/i3/Celeron® processor integrated Chipset DirectX 11, OpenGL *3.1, OpenCL* 1.1 Integrated hardware MPEG2 decoder Memory Shared system memory up to 512MB/ DVMT 5.0 Up to 2560 x 2048 for CRT (two display), 2048 x 1536 for three displays Up to 1920 x 1200 (UXGA) for LCD/HDMI Resolution Up to 2560 x 1600 for DP Up to 2548 x 1536 for DVI LCD Interface Up to 24-bit dual-channel LVDS HDMI Supports HDMI x 2 DVI Supports DVI x 2 DisplayPort Supports DisplayPort™ x 2 05-3 Note: All specifications are subject to change without notice. CD Row I/O Interface Display Interface AB Row I/O Interface Display Interface COM-QM77 Rev.B Dimension Unit: mm Solder Side Component Side Block Diagram Optional Accessories • TF-ECB-917T-A10 TX/RX x 2 COM Express Type 6 Carrier Board, Mini-ITX, Dual Gigabit Ethernet, 2.1CH Audio, 4 COM, USB3.0, PCI- LPC Express, AT/ATX, Rev. A1.0 SMbus USB 3.0 • TF-PER-A122 USB3.0 x 4 Heat Spreader, For COM-QM77, Onboard CPU SATA2.0 x 2 SATA SATA3.0 x 2 • TF-PER-A115 Intel® 82579LM CPU Cooler, 45W, for COM Express Basic Size to be used with Heat Spreader GbE DIO 8-bits USB 2.0 USB2.0 x 8 HDA Audio PCI Express PEG PCIe[x1] x 7 PCIe[x16] DDI DDI x 2 LCD 18/24-bit LVDS Analog CRT Ordering Information Part Number COM Express Type Chipset CPU Memory Display LVDS Storage LAN USB URAT Expansion Slot Power Temp. 3rd Generation Intel® Core™ i7- DDR3 SODIMM x 2 CRT, LVDS, SATA3 x 2 USB3.0 x 4 COM-QM77-B10 6 (COM.0 Rev.2.0) QM77 24-bit dual channel GbE x 1 2 (TX/RX) PCI-E [16] x 1,PCI-E [1] x 7 12V 0°C ~ 60°C 3555LE/2.5G (FCBGA1023) Max.16GB HDMI, DP, DVI SATA2 x 2 USB2.0 x 8 3rd Generation Intel® Core™ i7- DDR3 SODIMM x 2 CRT, LVDS, SATA3 x 2 USB3.0 x 4 COM-QM77-B10-01 6 (COM.0 Rev.2.0) QM77 24-bit dual channel GbE x 1 2 (TX/RX) PCI-E [16] x 1, PCI-E [1] x 7 12V 0°C ~ 60°C 3517UE/1.7G (FCBGA1023) Max.16GB HDMI, DP, DVI SATA2 x 2 USB2.0 x 8 3rd Generation Intel® Core™ i3- DDR3 SODIMM x 2 CRT, LVDS, SATA3 x 2 USB3.0 x 4 COM-QM77-B10-02 6 (COM.0 Rev.2.0) HM76 24-bit dual channel GbE x 1 2 (TX/RX) PCI-E [16] x 1, PCI-E [1] x 7 12V 0°C ~ 60°C 3217UE/1.6G (FCBGA1023) Max.16GB HDMI, DP, DVI SATA2 x 2 USB2.0 x 8 05-4 www.aaeonusa.com

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