Manufacturers
LANNER HCP-72I2 TCM-ISTC01A
Description
High Availability Rackmount 2U Telecom Network Appliance with 2 x86 CPU Blades and 3 I/O Blades
"The HCP-72i2 is a 2U rackmount telecom network appliance built with Lanner's unique Hybrid Telecommunications Computing Architecture (HybridTCA™),which is created to meet the challenging requirements for carrier-grade network control, cloud computing and data center. "The HCP-72i2 is a 2U rackmount telecom network appliance built with Lanner's unique Hybrid Telecommunications Computing Architecture (HybridTCA™),which is created to meet the challenging requirements for carrier-grade network control, cloud computing and data center. The HCP-72i2 integrates control, management and data processing in one system and has advantages over the prevalent AdvancedTCA infrastructure in aspects of hardware design, customization options and cost/energy efficiency. It comes with two x86 mainboards and each supports two Intel Xeon E5-2600 v3 series processors (Haswell-EP) on LGA2011-3. The HCP-72i2 integrates control, management and data processing in one system and has advantages over the prevalent AdvancedTCA infrastructure in aspects of hardware design, customization options and cost/energy efficiency. It comes with two x86 mainboards and each supports two Intel Xeon E5-2600 v3 series processors (Haswell-EP) on LGA2011-3. The HCP-72i2 can be fitted, via the three (max.) swappable I/O blades, with up to 36 1GbE network ports or 24 10GbE network ports in an array of SFP or copper combinations. This particular appliance also comes with 32 quad-channel DDR4 DIMM sockets and 2 removable SAS/SATA HDD bays, future-proofing most of the expansion needs."The HCP-72i2 can be fitted, via the three (max.) swappable I/O blades, with up to 36 1GbE network ports or 24 10GbE network ports in an array of SFP or copper combinations. This particular appliance also comes with 32 quad-channel DDR4 DIMM sockets and 2 removable SAS/SATA HDD bays, future-proofing most of the expansion needs."HybridTCA™ high-performance telecom network appliance with 2 CPU blades with 4 x Intel® Xeon® E5-2690 series v3 (Haswell-EP) processors
+ 2 bays for 2.5" HDDs with 3 I/O blades slots 12 ports GbE RJ45 networking I/O blade 12 ports GbE SFP networking I/O blade
Part Number
HCP-72I2 TCM-ISTC01A
Price
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Manufacturer
LANNER
Lead Time
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Category
Telecom Datacenter Appliances » Cloud Storage Platforms
Specifications
CPU
4 x Intel® Xeon® processor E5-2690 v3 series (Haswell-EP)
Chipset
Intel C612 Chipset
BIOS
AMI SPI Flash BIOS
Memory Technology
Quad-channel DDR4 2133 MHz (Registered)
Memory Capacity
512GB (Registered)
Memory Socket
Up to 32 x 240-pin DIMM
SATA storage
2 x 2.5" swappable drive bays, 2 x mSATA sockets
Ethernet controller
Intel 82574L & 82599ES
Default LAN
RJ-45,SFP, SFP+
Console
Up to 2 x RJ45; each blade x 1
USB 2.0
2 x Type A
IPMI via OPMA slot
OPMA socket to support IPMI (IAC-AST2300)
Power input
AC 100~240V@50~60Hz DC -36~-72V
Type/Watt
AC 1200 watt 1+1 Redundant /each DC 1010 watt 1+1 Redundant /each PM bus support
Reset
Yes
Processor cooling
Up to 4 x CPU heatsinks with fan duct; each blade x 2
System cooling
Up to 10 x independent hot-swappable cooling Fans with smart fan control, each blade x 5
Operating System
Linux Kernel 2.6 or above
Certifications
CE Class A, FCC Class A
Operating temperature
0°C to 40°C
Operating humidity
5% to 90% (non-condensing)
Dimensions (W x H x D)
431 mm x 88 mm x 718.1 mm (16.97" x 3.46" x 28.27")
Weight
35 kg (77 lbs)
LCD module
Hinge LCM
Watchdog
Yes
Internal RTC
Yes
Categorization Information
Telecom Datacenter Appliances
Cloud Storage Platforms
Features
- High availability, full redundancy and extreme high performance
- 2 CPU blades in the rear. Support up to 4 Intel® Xeon® E5-2690 v3 CPUs and 32x DDR4 R-DIMM
- Dual mainboard communication through NTB port
- 3 swappable I/O blades on the front. Support up to 36 x 1GbE or 24 x 10GbE network ports in an array
- 2 x swappable 2.5" HDD bay
- NEBS compliance
- Redundant power supply and removable fan module
- IPMI port for remote management
- Hinge LCD module for easy diagnostics and configuration
Datasheet
Extracted Text
High Availability Rackmount 2U Telecom HCP-72i2 Network Appliance with 2 x86 CPU Blades and 3 I/O Blades Features • High availability, full redundancy and extreme high performance • 2 CPU blades in the rear. Supports up to 4 Intel® Xeon® E5-2690 v3 CPUs and 32x DDR4 R-DIMM • Dual Mainboard communication through NTB port • 3 swappable I/O blades on the front. Support up to 36 x 1GbE or 24 x 10GbE network ports in an array of SFP or copper combinations • 2 x swappable 2.5” HDD bay • NEBS compliance • Redundant power supply and removable fan module Preliminary Specifications Environment Processor System Operating/Storage 0 ~ 55ºC / 105W CPU 4 x Intel® Xeon® processor E5-2690 v3 series Temperature 0 ~ 40ºC / 135W (Haswell-EP) Frequency Depending on CPU Relative Humidity 5% ~ 90%, non-condensing Miscellaneous Core Number Depending on CPU LCD Module Hinge LCM BIOS AMI SPI Flash BIOS Watchdog Yes Chipset Intel C612 Chipset Internal RTC with Li Yes Memory Battery Technology Quad-channel DDR4 2133 MHz (Registered) Mechanical Max. Capacity 512GB (Registered) Dimension (W x H x D) 431 x 88 x 718.1 mm Socket Up to 32 x 240-pin DIMM Weight 35 kg Networking Mounting Rack mount Controller Intel 82574L & 82599ES Power Speed 10/100/1000 Mbps Type / Watts AC 1200 watt 1+1 Redundant /each DC 1010 watt 1+1 Redundant /each Interface RJ-45 ,SFP, SFP+ PM bus support Storage Input AC 100~240V@50~60Hz DC -36~-72V Type SATA OS Support Installation 2 x 2.5” swappable drive bays Linux Linux Kernel 2.6 or above Type mSATA Certification Installation 2 x mSATA sockets EMC CE Class A, FCC Class A I/O Reset Button Yes Console Up to 2 x RJ45; each blade x 1 USB 2 x type A IPMI OPMA socket to support IPMI (IAC-AST2300) H.A. port 2 x 10G SFP+ Expansion PCIe N/A PCI N/A Cooling Processor Up to 4 x CPU heatsinks with fan duct; each blade x 2 System Up to 10 x independent hot-swappable cooling Fans with smart fan control, each blade x 5 Network Appliance Product I/O View G F E A B D C Sync port A Hinge LCM D G RPS Swappable I/O Blades B Console E CPU Blades C LOM port F Dimensions 431 x 88 x 718.1 mm Ordering Information HybridTCA™ high-performance telecom network appliance with 2 CPU blades with 4 x Intel® Xeon® E5-2690 series v3 (Haswell-EP) proces- HCP-72i2 sors + 2 bays for 2.5” HDDs with 3 I/O blades slots TCM-IGTC01A 12 ports GbE RJ45 networking I/O blade TCM-ISTC01A 12 ports GbE SFP networking I/O blade TCM-IXM801A 8 ports 10GbE SFP+ networking I/O blade V.1-2016.1.26 © Lanner Electronics Inc. All rights reserved. All product specifications are subject to change without notice. connect@lannerinc.com | www.lannerinc.com HCP-72i2
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