AXIOMTEK CEM500PG-I7-6820EQ (P/N-E38D500100)

Description
COM Express Type 6 Module with 6th Generation Intel® Core™ i7/i5/i3 & Celeron® Processor, Intel® QM170/HM170
The CEM500, a COM Express Type 6 basic module, is based on the 14nm 6th generation Intel® Core™ i7/i5/i3 and Celeron® processors (codename: Skylake-H) with Intel® QM170/HM170 chipset. The outstanding Intel® Gen 9 HD Graphics enables the CEM500 driving multiple 4K displays without the need of a discrete graphics card. Two DDR4-2133 SO-DIMM supporting up to 32 GB system memory capacity and four SATA-600 with RAID 0, 1, 5, and 10 are available. Additionally, the rugged COM Express computer-on-module Type 6 supports an industrial operating temperature range of -40°C to 85°C for applications in extreme harsh environment. With its full solid, outstanding computing performance and low power consumption design, the CEM500 is targeted at telecommunication, medical imaging, digital signage, gaming machines, military, human machine interface, industrial automation controllers and IIoT applications. COM Express type 6 module with Intel® Core™ i7-6820EQ 2.8 GHz, DDI/LVDS, GbE LAN, USB 3.0 and TPM
Part Number
CEM500PG-I7-6820EQ (P/N-E38D500100)
Price
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Manufacturer
AXIOMTEK
Lead Time
Request Quote
Category
Boards & Modules » System on Module
Specifications
CPU
6th generation Intel® Core™ & Celeron® processor (Skylake-H) with i7-6820EQ (45W), i5-6440EQ (45W), i3-6100E (35W)
Chipset
Intel® QM170/HM170
System Memory
2 x SO-DIMM DDR4-2133 up to 32 GB
BIOS
AMI
COM
2 x TX/RX
USB
4 x USB 3.0 8 x USB 2.0
Ethernet
1 x 10/100/1000Mbps (Intel® i219LM)
Display
1 x LVDS (optional with eDP)3 x DDI (DP/HDMI/DVI); 1 DDI optional with VGA
Digital I/O
4-IN & 4-OUT
Audio
HD link interface to baseboard for Codec
Storage
4 x SATA-600 with RAID 0/1/5/10
Expansion
1 x PCIe x16 v3.08 x PCIe x1
Others
1 x LPC interface1 x SPI interface1 x I2C interface
Power Input
ATX: +12V, +5VSBAT: +12V
Watchdog Timer
255 levels, 1~255 sec.
Hardware Monitoring
Yes
Operating Temperature
-40ºC ~ +85ºC (-40ºF ~ +185ºF)
Relative Humidity
10% ~ 95% relative humidity, non-condensing
Dimensions
125 x 95 mm
Board Thickness
2.0 mm
Certification
CE
Categorization Information
Boards & Modules
System on Module
COM Express Type 6
Features
- 6th generation Intel® Core™ i7/i5/i3 & Celeron® processor (Skylake-H)
- Intel® QM170/HM170 chipset
- 2 DDR4-2133 SO-DIMMs max. up to 32 GB
- Max. 24 lanes of PCIe
- 4 SATA-600 with RAID 0/1/5/10
- 4 USB 3.0 and 8 USB 2.0
- Intel® AMT 11.0 and TPM function supported
- Intelligent remote management software AXView 2.0 supported
Datasheet
Extracted Text
COM Express Type 6 Module CEM500 COM Express Type 6 Module with Intel® Xeon® and 6th Gen Intel® Core™ i7/i5/i3 Processor, Intel® CM236/QM170/HM170 6th Gen. Intel® Xeon® and Core™ Processor Features ● 6th gen Intel® Xeon® and Core™ i7/i5/i3 processors (Skylake-H) ● Intel® CM236/QM170/HM170 chipset ● 2 DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC 2 x DDR4 Intel® CM236/ ● 1 x PCIe x16 and 8 x PCIe x1 Gen. 3 SO-DIMM QM170/HM170 ● 4 SATA-600 with RAID 0/1/5/10 ● 4 USB 3.0 and 8 USB 2.0 ● Intel® AMT 11.0 and TPM function supported ● AXView 2.0 intelligent remote management software 0 1 2 COM Express DDR4 DDR4 USB USB Interface Connector Full Solid DDR4 USB 3.0 TripleView AiRD Ext. Temp Rear view AXView Cap Design 3 Display Core System CPU Intel® Xeon® and 6th generation Intel® Core™ processor Chipset Intel® Gen 9 HD Graphic Gfx APIs - DX11/12, OCL2.x, OGL 4.3/4.4 (Skylake H): E3-1505M v5 (45 W), i7-6820EQ (45 W), 4 3 independent displays i7-6822EQ (25 W), i5-6440EQ (45 W), i3-6100E (35 W) Display Interface 1 x LVDS; 18/24-bit single/dual channel (optional with eDP) System Memory 2 x DDR4-2133 SO-DIMM, up to 32GB ECC or non-ECC 3 x DDI (DP/HDMI/DVI), 1 x DDI optional w/VGA Chipset Intel® CM236/QM170/HM170 BIOS AMI uEFI with Intel® Active Management Technology 11.0 5 supported Packing List SSD N/A Quick installation guide, user’s manual/utility CD Watchdog Timer 65536 levels, 0~65535 sec. Expansion Interface 1 x PCIe x16 v3.0 6 8 x PCIe x1 v3.0 Ordering Information Battery Lithium N/A Standard Power Input ATX: +12V, +5VSB; AT: +12V CEM500PG-E3- COM Express Type 6 module with Intel® Xeon® E3-1505M Size 125 x 95 mm 7 1505M+CM236 v5 2.8 GHz, CM236, ECC, DDI/LVDS, GbE LAN, USB 3.0 and Board Thickness 2.0 mm (P/N: E38D500109) TPM Temperature -40ºC ~ +85ºC (-40ºF ~ +185ºF), operation CEM500PG-i3- COM Express Type 6 module with Intel® Core™ i3-6100E Operation Humidity 10% ~ 95% relative humidity, non-condensing 6100E+CM236 2.7 GHz, CM236, ECC, DDI/LVDS, GbE LAN, USB 3.0 and (P/N: E38D500105) TPM Vibration 3.5 Grms CEM500PG-i7- COM Express Type 6 module with Intel® Core™ i7-6822EQ 6822EQ+QM170 2.0 GHz, QM170, DDI/LVDS, GbE LAN, USB 3.0 and TPM I/O (P/N: E38D500106) CEM500PG-i7- COM Express Type 6 module with Intel® Core™ i7-6820EQ MIO 1 x LPC interface 6820EQ+QM170 2.8 GHz, QM170 DDI/LVDS, GbE LAN, USB 3.0 and TPM 1 x SPI interface 2 (P/N: E38D500100) 1 x I C interface CEM500PG-i5- COM Express Type 6 module with Intel® Core™ i5-6440EQ 2 x TX/RX serial interface 6440EQ+QM170 2.7 GHz, QM170 DDI/LVDS, GbE LAN, USB 3.0 and TPM SATA 4 x SATA-600 with RAID 0/1/5/10 (P/N: E38D500101) Hardware Monitoring Yes CEM500PG-i3- COM Express Type 6 module with Intel® Core™ i3-6100E Ethernet 1 port as 10/100/1000 Mbps supports Wake-on-LAN, 6100E+QM170 2.7 GHz, QM170 DDI/LVDS, GbE LAN, USB 3.0 and TPM PXE Boot ROM with Intel® i219LM (P/N: E38D500108) Audio HD link interface to baseboard for Codec USB 4 x USB 3.0 Optional 8 x USB 2.0 CEB94006 ATX form factor Type 6 evaluation board TPM ST for trusted platform (P/N: E394006100) SMBus Yes TS008-CEM500 CEM500 Heatsink w/fan Digital I/O 4 channels IN & 4 channels OUT (P/N: E39J008100) Smart Battery Yes TS006-CEM500 CEM500 Heatspreader (P/N: E39J006100) axiomtek.com 80 * All specifications and photos are subject to change without notice. © 2017 Axiomtek Co., Ltd. All rights reserved.
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