AXIOMTEK CAPA110

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Details

Part Number CAPA110
Manufacturer AXIOMTEK
Category Uncategorized
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Our Process

Our Process: Preparation
Preparation

Once you accept your quote and confirm your order, we prepare by retrieving related parts and components from our inventory. Anything we do not currently have in stock is sourced.

Our Process: Receiving
Receiving

Upon receipt, all parts are visually inspected for damage and then photographed to document their condition. Parts acquired from vendors must meet our quality standards.

Our Process: Initial Testing
Initial Testing

Industrial computer boards and other parts we are equipped to evaluate are tested to verify functionality and discover possible damage.

Our Process: Refurbishment
Refurbishment

Industrial computer boards have all components with low MTBF numbers (such as capacitors and connectors) replaced and are washed in our PCB cleaner to remove dust and grime.

Our Process: Repair
Repair

Industrial computer boards are fully diagnosed and repaired by our engineers. Logs of the problems encountered and solutions implemented are recorded.

Our Process: Final Testing
Final Testing

Industrial computer boards have all I/O connections rigorously tested to ensure that everything is working properly before the board is certified as ready to ship.

Our Process: Shipping
Shipping

After photos are taken to document the exterior condition of the part, it is packaged and sent to the customer. ESD-safe materials are used to protect sensitive equipment on its journey.

Who We Are

IPC Station is a website of GID Industrial, an ISO 9001:2015-certified company that has specialized in servicing industrial computer boards and providing other industrial products for sectors including manufacturing, defense, aerospace, entertainment, healthcare, and more by utilizing our combined skills and vast international network of trusted suppliers since our founding in 2015.

Do you need a CAPA110? We can help you find it at a competitive price!

Specifications

CPU AMD G-Series APU dual core T56N (1.65 GHz)
Chipset AMD FCH A50M chipset
Memory 1 x 204-pin SO-DIMM supports DDR3 1333 max. up to 4 GB
Video 1 x VGA
1 x DisplayPort
1 x LVDS; 18/24-bit single/dual channel
LAN 2 port 10/100/1000 Mbps supports Wake-on-LAN, RPL/PXE Boot ROM with Realtek RTL8111E
I/O Ports 1 x RS-232/422/485 (COM1); with +5V/+12V powered
3 x RS-232 (COM2/3/4) ; with +5V/+12V powered
6 x USB 2.0
Digital I/O: 8 channels IN/OUT programmable
Storage Interface 2 x SATA-600, 1 x CompactFlash™
Audio HD Codec audio as MIC-in/Line-in/Line-out/Speaker-out with Realtek ALC662
Expansion Interface 1 x PCI Express Mini Card
Power Requirement AMD G-Series APU T56N @ 1.65 GHz, 1GB DDR3 Max. RMS: +12V @ 1.5A
Operating Temperature 0°C ~ +60°C (32°F ~ 140°F), operation
Other Info AMD G-Series APU 3.5" Embedded SBC with AMD FCH A50M Chipset
LVDS/DisplayPort/VGA, Dual LANs and Audio

Features

  • AMD G-Series APU dual core T56N (1.65 GHz)
  • AMD FCH A50M chipset
  • 1 DDR3 SO-DIMM supports up to 4 GB memory capacity
  • 6 USB 2.0 ports
  •  4 COM ports ®11 support

Datasheet

Download "capa1101.pdf" (237 KiB)

Extracted Text

www.axiomtek.com CAPA110 AMD G-Series APU 3.5" Embedded SBC with AMD FCH A50M Chipset, LVDS/DisplayPort/VGA, Dual LANs and Audio VGA USB 3~6 Ethernet 1 Ethernet 2 DisplayPort USB 1/2 Features AMD G-series APU Low Power DualView 2 G.E. Audio LVDS/VGA  AMD G-Series APU dual core T56N (1.65 GHz) SATA DisplayPort  AMD FCH A50M chipset COM 1 6 USB 2.0  1 DDR3 SO-DIMM supports up to 4 GB memory COM 3/4 PCIe Mini Card capacity CompactFlash™  6 USB 2.0 ports  4 COM ports ®  11 support COM2 PCI Express LVDS Mini Card System CF type-II AMD G-Series APU dual core T56N (1.65 GHz) DDR S System Memory ystem Memory 1 x 204-pin SO-DIMM supports DDR3 1333 max. up to 4 GB SO-DIMM AMD FCH A50M chipset B BIIOS OS AMI BIOS Rear view 1 x CompactFlash™ Wa Watchdo tchdog g T Timer imer 255 levels, 1~255 sec. 1 x PCI Express Mini Card B Battery attery Lithium 3V/220mAH 3. 2 x 2-pin connector +12V DC-in only AT Auto Power ON function supported P Power R ower Requirement equirement AMD G-Series APU T56N @ 1.65 GHz, 1GB DDR3 Max. RMS: +12V @ 1.5A 146 x 104mm Side view Boa Board rd Thi Thic ckn kness ess 1.6 mm 0°C ~ +60°C (32°F ~ 140°F), operation Op Operation Humidit eration Humidity y 10% ~ 95% relative humidity, non-condensing Packing List I/O 1 x RS-232/422/485 (COM1); with +5V/+12V powered Quick installation guide, user's manual/utility CD, cable 3 x RS-232 (COM2/3/4) ; with +5V/+12V powered S SAT ATA A 2 x SATA-600 Part Number Description Qty Detect CPU/system temperature, voltage and fan speed 59382620000E 1 x COM w/ bracket P=2.0mm, L=300mm 1 Ethe Ethern rnet et 2 port 10/100/1000 Mbps supports Wake-on-LAN, 59384500100E Audio cable w/ bracket P=2, 450mm 1 RPL/PXE Boot ROM with Realtek RTL8111E 59382631000E 2 x USB 2.0 wafer cable w/ bracket 1 HD Codec audio as MIC-in/Line-in/Line-out/Speaker-out 180mm with Realtek ALC662 US USB B 6 x USB 2.0 59380000300E 2 x COM w/ bracket P=1.27 x 2.54 L=300mm System Management Bus for advanced monitoring/control 59070213000E DisplayPort to VGA cable, L=100mm (optional) 59040131000E DisplayPort to DVI cable, L=220mm D Diig gital I/O ital I/O 8 channels IN/OUT programmable 59050203000E DisplayPort to HDMI cable, L=200mm 59091501000E DisplayPort to DisplayPort cable, L=1500mm Ordering Information Display ® AMD G-series APU integrated graphic engine CAPA110VPGGA-T56N 3.5" SBC with AMD G-Series APU T56N T56N - Radeon™ HD6320 (P/N: E38E110105) 1.65 GHz, VGA/DisplayPort/LVDS, Memory Size Memory Size Max. up to 2 GB in 4 GB DDR3 module 2 10/100/1000Mbps Ethernet and audio p 1 x VGA 1 x DisplayPort 1 x LVDS; 18/24-bit single/dual channel * All specifications and photos are subject to change without notice. 119

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